Capacitor Dual-Upper Electrode Structure for Dielectric Protection
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Solution Overview
Problem
Conventional capacitor manufacturing techniques result in quality deterioration of the dielectric layer due to impurity diffusion and surface roughening, leading to poor capacitor performance with issues like leak currents, increased dielectric loss, and reduced capacitance.
Innovation Solution
A capacitor design featuring a dual-layered upper electrode structure that prevents impurity diffusion and surface roughening, comprising a substrate with a lower electrode, a dielectric layer, and dual-layered upper electrodes that cover the dielectric layer's opening portions, ensuring high-quality dielectric layer formation and protection from photolithography-related damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a photoresist pattern is formed on the dielectric layer for patterning, then the dielectric layer can be patterned to form the capacitor structure, but impurities from the photoresist diffuse into the dielectric layer causing quality deterioration
Solution Approach 1:
A protective film is introduced as an intermediary layer between the photoresist pattern and the dielectric layer. This protective film receives the photoresist pattern during patterning operations, preventing direct contact between photoresist impurities and the dielectric layer, while still allowing the patterning process to proceed effectively.
Solution Approach 2:
The protective film is formed on the dielectric layer before the photoresist patterning process begins. This preliminary protective layer is in place to prevent impurity diffusion into the dielectric layer during subsequent patterning steps, ensuring dielectric quality is maintained from the outset.
2Ease of operation
If the dielectric layer is entirely exposed to etching liquid for photoresist removal, then the photoresist can be completely removed, but the surface of the dielectric layer becomes roughened
Solution Approach 1:
The protective film serves as a mediator that shields the dielectric layer surface from direct exposure to etching liquid. Photoresist removal can be performed through the protective film or the film is removed selectively, preventing etching liquid from roughening the dielectric layer surface while still achieving complete photoresist removal.
Solution Approach 2:
The protective film provides beforehand cushioning protection to the dielectric layer surface against the harmful effects of etching liquid. This protective layer absorbs or prevents the damaging interaction between the etching liquid and the dielectric layer, maintaining surface quality during the photoresist removal process.
3Device complexity
If conventional single-layer electrode structure is used, then the manufacturing process is simpler, but the dielectric layer is vulnerable to impurity diffusion and surface roughening
Solution Approach 1:
The upper electrode is segmented into a first electrode layer and a second electrode layer. The first electrode layer is positioned to provide protective coverage over the dielectric layer during patterning operations, while the second electrode layer provides the functional electrode structure, dividing the protective and functional roles into separate layers.
Solution Approach 2:
The first electrode layer serves multiple functions: it acts as a protective barrier during photoresist patterning to prevent impurity diffusion, provides structural support, and contributes to the overall electrode functionality. This multi-functional layer combines protection and electrical function in a single component.
Data Source
AI summary
A capacitor having a high quality and a manufacturing method of the same are provided.A capacitor has a lower electrode formed on an oxide film, a dielectric layer formed on the lower electrode, an upper electrode formed so as to face the lower electrode with the dielectric layer between, and an upper electrode formed so as to cover the upper electrode, an opening portion of the upper electrode and an opening portion of the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to pattern the dielectric layer by using the upper electrode as a mask, and provide a capacitor having a high-quality dielectric layer by preventing impurity diffusion into the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to prevent the dielectric layer from being exposed to etching liquid, liquid developer, etc.