Multilayer Capacitor Electrode Patterning for Short-Circuit Suppression
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving smaller size and higher capacitance due to internal electrode thickness, leading to potential short circuits, reduced capacitance, and lower breakdown voltage, along with issues of internal electrode smoothness and connectivity.
Innovation Solution
A multilayer electronic component design with alternately disposed dielectric layers and internal electrodes, featuring conductor and cut-off portions, aims to enhance connectivity and reliability by maintaining a uniform thickness and smoothness of internal electrode patterns, using a manufacturing method like reverse offset printing to ensure high-speed production and improved surface characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the internal electrode thickness is reduced to achieve smaller size and higher capacitance, then the capacitance and size requirements are met, but short circuits between internal electrodes, reduced breakdown voltage, and poor connectivity occur
Solution Approach 1:
The patent applies local quality by creating conductor portions with non-uniform thickness distribution. The internal electrode has thicker regions (conductor portions) at critical locations and thinner regions (cut-off portions) elsewhere. This local variation in thickness ensures adequate connectivity and breakdown voltage at electrode ends while maintaining overall small size and high capacitance.
Solution Approach 2:
The patent changes the thickness parameter of the internal electrode from uniform to non-uniform distribution. By controlling the thickness distribution pattern (with conductor portions having specific thickness ranges and cut-off portions having reduced thickness), the patent optimizes both reliability and capacitance performance.
2Volume of moving object
If the internal electrode thickness is reduced to achieve smaller size, then the component size is reduced, but the connectivity of internal electrode ends deteriorates
Solution Approach 1:
The patent ensures adequate connectivity by providing conductor portions with sufficient thickness (e.g., 50-200 nm) at critical electrode end regions. These localized thick regions maintain electrical connectivity even when the overall electrode thickness is reduced to enable smaller component size.
Solution Approach 2:
The internal electrode is segmented into conductor portions and cut-off portions along its length. This segmentation allows different regions to serve different functions: conductor portions ensure connectivity and electrical performance, while cut-off portions reduce overall material usage and enable smaller component size.
3Quantity of substance
If the internal electrode thickness is reduced to achieve higher capacitance per unit volume, then the capacitance density is improved, but the smoothness and uniformity of the electrode surface deteriorates
Solution Approach 1:
The patent achieves high capacitance per unit volume through controlled non-uniform thickness distribution. The conductor portions have precise thickness control (e.g., 50-200 nm) ensuring smooth surfaces at critical regions, while cut-off portions have reduced thickness to increase overall capacitance density.
Solution Approach 2:
The patent optimizes capacitance per unit volume by changing the thickness parameter distribution pattern. By carefully controlling the thickness of conductor portions and the spacing of cut-off portions, high capacitance density is achieved while maintaining adequate surface smoothness for manufacturing.
4Ease of manufacture
If conventional manufacturing methods are used for internal electrodes, then production is simpler, but productivity and manufacturing efficiency are lower
Solution Approach 1:
The non-uniform thickness pattern (conductor and cut-off portions) is established during the green sheet fabrication stage before sintering. This preliminary formation of the thickness distribution pattern enables high-speed production through continuous processing methods while maintaining manufacturing simplicity.
Solution Approach 2:
The patent enables high-speed manufacturing by controlling the thickness parameter distribution during green sheet fabrication. The conductor and cut-off portions are formed in a single continuous process, eliminating the need for multiple post-processing steps and significantly improving manufacturing efficiency.
Data Source
AI summary
A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage. The internal electrode may include a plurality of conductor portions and a plurality of cut-off portions.