Multilayer Capacitor Electrode Grooves for Moisture Resistance
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with moisture penetration, leading to reduced insulation breakdown voltage and reliability in harsh environments.
Innovation Solution
A multilayer electronic component design featuring internal electrodes with external electrodes having grooves filled by plating layers, which complicates the penetration path for external moisture, enhancing moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the external electrode structure is simplified, then the manufacturing process is easier, but moisture penetration resistance deteriorates
Solution Approach 1:
The external electrode is segmented into multiple functional layers: base electrode layer, lower plating layer, upper plating layer, and groove structures. This segmentation creates multiple barriers that moisture must penetrate, significantly improving moisture resistance while maintaining manufacturability through standardized layering processes
Solution Approach 2:
The electrode structure extends into the depth dimension with grooves that the plating layers fill, creating a three-dimensional moisture barrier. The grooves penetrate into the body surface, and the plating layers extend into these grooves, adding depth to the moisture protection strategy without complicating the surface layout
2Reliability
If grooves are added to the body surface, then moisture penetration path is complicated, but device complexity increases
Solution Approach 1:
The grooves are pre-formed on the body surface before the plating layers are applied. This preliminary action allows the plating layers to naturally flow into and fill the grooves during the plating process, creating an integrated moisture barrier without requiring additional complex assembly steps
Solution Approach 2:
The groove formation and plating processes are merged into an integrated manufacturing sequence. The grooves are formed first, then the plating layers are applied in a continuous process, combining structural modification and electrode formation into a unified manufacturing flow that reduces overall complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves the moisture resistance reliability of the multilayer electronic component by creating a more complex penetration path for external moisture, reducing the risk of defects and maintaining electrical performance.
Implementation Method 1
The body includes a first groove and a second groove disposed on ends of the first and second band portions, respectively, and spaced apart from each other. Ends of the first lower plating layer and the first upper plating layer respectively fill at least portions of the first groove, and ends of the second lower plating layer and the second upper plating layer respectively fill at least portions of the second groove.
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer therebetween, an external electrode including a connection portion and a band portion extending from the connection portion onto at least one of the first, second, fifth and sixth surfaces. The external electrode includes a base electrode layer, a lower plating layer disposed on the base electrode layer, and an upper plating layer disposed on the lower plating layer. The body includes a groove disposed on end of the band portion. Ends of the lower and upper plating layers respectively fill at least portions of the groove.