Multilayer Ceramic Capacitor Electrode Extension for Tilt Prevention
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Solution Overview
Problem
Multilayer ceramic electronic components face challenges in size reduction and mounting stability due to tilting issues caused by stress during soldering, which affects appearance and fixing strength.
Innovation Solution
The design includes a multilayer ceramic electronic component with specific electrode configurations, where the first and second outer electrodes are extended to the principal surfaces and side surfaces, with defined length ratios (A/B) to prevent tilting by creating a downward force when a joining material melts during mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the multilayer ceramic electronic component is mounted with solder wetting, then the component is fixed to the circuit board, but stress is generated causing tilt of the component
Solution Approach 1:
The patent applies preliminary anti-action by designing the outer electrode to extend beyond the end surface of the multilayer body, creating a counterbalancing structure that prevents tilt before it occurs. The extended electrode portion acts as a counterweight that offsets the tilting force generated during soldering, thereby maintaining component stability while ensuring reliable fixation.
Solution Approach 2:
The patent implements the counterweight principle by extending the outer electrode beyond the end surface of the multilayer body. This extended electrode portion functions as a counterweight that balances the stress-induced tilting force during soldering, preventing the component from tilting while maintaining strong fixation to the circuit board.
2Stability of the object's composition
If the outer electrode is extended to prevent tilt, then the component stability is improved, but the mounting space requirement increases
Solution Approach 1:
The patent applies dimensionality change by extending the outer electrode in the thickness direction (vertical dimension) rather than increasing the horizontal footprint. This allows the electrode to provide tilt-prevention functionality while minimizing the increase in mounting space, as the extension is primarily in the vertical dimension where it can counterbalance stress without significantly increasing the horizontal area occupied on the circuit board.
3Volume of moving object
If the component size is reduced, then the space utilization is improved, but the solder fillet space requirement increases the mounting area
Solution Approach 1:
The patent applies dimensionality change by transitioning from a mounting structure that requires horizontal solder fillet spread to one where the outer electrode extends vertically beyond the end surface. This allows the solder to wet the extended electrode portion in the vertical dimension, reducing the required horizontal mounting area and enabling smaller component footprints while maintaining reliable connections.
Solution Approach 2:
The patent inverts the traditional mounting approach by extending the electrode beyond the end surface rather than requiring the solder fillet to spread horizontally from the end surface. This inversion allows the solder to wet the extended electrode portion, eliminating the need for additional horizontal space for the solder fillet and enabling more compact mounting.
Data Source
AI summary
A multilayer ceramic capacitor a multilayer body including ceramic layers and principal surfaces opposing each other, side surfaces opposing each other, and end surfaces opposing each other, the principal surface defining and functioning as a mounting surface; an inner electrode located within the multilayer body and partially extended to the principal surface; an outer electrode located on the principal surface and connected to the inner electrode. The outer electrode includes outer electrode side surface portions located also on portions of the side surfaces. When a length of the outer electrode side surface portions in a direction connecting the principal surfaces is indicated by A, and a length of the multilayer body in the direction connecting the principal surfaces is indicated by B, 0.063≤A/B≤1.000 is satisfied.