Multilayer Capacitor Encapsulation for Noise and Fixing Strength
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Solution Overview
Problem
Existing electronic components using multilayer capacitors face issues with inadequate acoustic noise reduction and poor fixing strength, leading to discomfort and reliability concerns due to vibrations and humidity permeation.
Innovation Solution
An electronic component design incorporating a multilayer capacitor with an interposer and encapsulation portion, where the interposer has bonding, mounting, and connection portions, and an encapsulation layer of specific thickness to enhance fixing strength and humidity resistance while reducing acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If an interposer is disposed between a multilayer capacitor and a board, then acoustic noise is reduced, but fixing strength between the multilayer capacitor and metal frame is insufficient
Solution Approach 1:
The encapsulation portion merges multiple functions into a single structural element: it provides mechanical fixation between the multilayer capacitor and metal frame, seals against humidity, and dampens vibrations. This integration resolves the contradiction by combining the previously separate functions of mechanical support and environmental protection into one unified component that achieves both acoustic noise reduction and sufficient fixing strength.
Solution Approach 2:
The encapsulation portion appears to be constructed from composite materials that simultaneously provide mechanical strength for secure mounting, vibration damping properties for noise reduction, and moisture barrier characteristics for humidity resistance. This material composition enables the single component to satisfy multiple conflicting requirements.
2Object-generated harmful factors
If an interposer is used to reduce acoustic noise, then vibration transmission is reduced, but fixing strength and reliability are compromised
Solution Approach 1:
The encapsulation portion combines vibration damping, mechanical fixation, and environmental sealing functions into a single integrated structure. This merging ensures that vibration transmission is reduced while maintaining secure mounting and reliable protection against humidity, thereby achieving both vibration reduction and mounting reliability simultaneously.
3Strength
If the encapsulation portion thickness is increased, then fixing strength and humidity resistance are improved, but acoustic noise reduction effect is degraded
Solution Approach 1:
The patent optimizes the thickness parameter of the encapsulation portion to achieve the best balance between fixing strength and acoustic noise reduction. By carefully controlling this dimensional parameter, the design achieves sufficient mechanical strength and humidity protection while maintaining effective vibration damping and noise reduction performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces acoustic noise, improves fixing strength, and enhances humidity resistance reliability by encapsulating the multilayer capacitor and interposer, preventing vibration transfer and external substance permeation.
Implementation Method 1
an encapsulation portion disposed to cover the multilayer capacitor... effectively reduces acoustic noise, improves fixing strength, and enhances humidity resistance reliability by encapsulating the multilayer capacitor and interposer, preventing vibration transfer
Implementation Method 2
when external humidity or the like permeates into a multilayer capacitor through a capacitor body, reliability of a product may be degraded... enhances humidity resistance reliability by encapsulating the multilayer capacitor and interposer, preventing vibration transfer and external substance permeation
Data Source
AI summary
An electronic component includes a multilayer capacitor including a capacitor body, and an external electrode disposed on an external surface of the capacitor body, an interposer including an interposer body, and an external terminals disposed on an external surface of the interposer body, and an encapsulation portion disposed to cover the multilayer capacitor. The external terminal includes a bonding portion disposed on a first surface of the interposer body to be electrically connected to the external electrode, a mounting portion disposed on a second surface of the interposer opposing the first surface, and a connection portion disposed on an end surface of the interposer to electrically connect the bonding portion to the mounting portion. A thickness of the encapsulation portion is within a range from 0.001 to 0.01 of a length of the electronic component.