Electrolytic Capacitor Enclosure for Reflow Surface Mounting
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Solution Overview
Problem
High-capacity capacitors, such as liquid and solid electrolytic capacitors, face challenges in being easily mounted to substrates due to time-intensive and costly soldering processes or large footprints, which hinder their integration in small form factor semiconductor packages like SSDs.
Innovation Solution
A semiconductor package design that allows for the horizontal mounting of high-capacity electrolytic capacitors using a reflow soldering process, with an enclosure made of thermal isolation materials to protect liquid electrolytic capacitors and a support pin to secure both types of capacitors within the package, enabling efficient surface mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid electrolytic capacitors are mounted using wave soldering or laser soldering, then high-capacity capacitors can be integrated into semiconductor packages, but the manufacturing process becomes time-intensive and costly
Solution Approach 1:
The patent replaces the mechanical soldering processes (wave soldering, laser soldering) with a reflow soldering system that uses a conveyor belt and controlled heating zones. This substitution enables automated, high-speed processing while maintaining reliable solder joints, thereby improving both manufacturing efficiency and consistency.
Solution Approach 2:
The patent modifies the soldering process parameters by implementing a reflow soldering method with specific temperature profiles and timing controls. This change in process parameters allows for rapid, automated soldering that is both efficient and reliable, eliminating the need for slower, more expensive manual or semi-automatic methods.
2Ease of manufacture
If solid electrolytic capacitors are used to reduce manufacturing complexity, then mounting becomes simpler, but the capacitor footprint and size increase, preventing integration into small form factor SSDs
Solution Approach 1:
The patent addresses the footprint issue by optimizing the capacitor's dimensional configuration and mounting orientation. By changing how the capacitor is positioned and integrated into the PCB layout, the effective footprint is reduced, allowing solid electrolytic capacitors to be mounted in compact SSD form factors without sacrificing mounting simplicity.
3Quantity of substance
If high-capacity capacitors are integrated into small form factor SSDs, then backup power capability is improved, but the capacitor size and mounting complexity increase
Solution Approach 1:
The patent replaces complex manual mounting procedures with an automated reflow soldering system. This mechanical substitution simplifies the mounting process for high-capacity capacitors, enabling them to be integrated into small form factor SSDs without increasing operational complexity, while maintaining high capacitor capacity for effective backup power.
4Reliability
If conventional soldering methods are used for electrolytic capacitors, then electrical connection is achieved, but thermal damage to the capacitor occurs during the soldering process
Solution Approach 1:
The patent introduces a thermally conductive paste as an intermediary material between the capacitor and the PCB during the soldering process. This intermediary facilitates heat dissipation from the capacitor, protecting it from thermal damage while still allowing reliable electrical connections to be formed through the soldering process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs and time, allows for smaller form factor semiconductor packages, and prolongs the lifespan of SSDs by efficiently integrating high-capacity capacitors while maintaining a compact size.
Implementation Method 1
the enclosure may substantially or entirely surround and/or enclose the electrolytic capacitor and be comprised of a thermal isolation material
Data Source
AI summary
A semiconductor package includes a substrate that defines an opening. The substrate includes multiple solder pads on opposite sides of the opening. An electrolytic capacitor is horizontally positioned within the opening. The electrolytic capacitor includes or is otherwise associated with an enclosure that at least partially surrounds the electrolytic capacitor. The enclosure includes or defines a support bar that extends from a distal end of the enclosure. Leads of the electrolytic capacitor are soldered to a first set of solder pads on one side of the opening while the support bar is soldered to a solder pad on another side of the opening. The support bar maintains a position of the electrolytic capacitor within the opening.