Thin-Film Capacitor Frame Substrate Segmentation

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Solution Overview

Problem

Thin-film capacitors on silicon substrates are prone to brittle fracture when reduced in thickness, making them unsuitable for small-size electronic devices, and there is a need for enhanced strength and durability.

Innovation Solution

A thin-film capacitor design featuring a substrate divided into parts by a penetration portion with a frame portion along the outer edge and an electrode portion inside, utilizing a metal material substrate with an insulating resin filling the penetration portion to enhance electric insulation and strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the thickness of the silicon substrate is decreased to reduce the size of the thin-film capacitor, then the capacitor can be mounted on small-size electronic devices, but the substrate becomes prone to brittle fracture

Engineering Contradiction:

Improvesize of thin-film capacitorVSAvoidstrength of substrate

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The substrate is divided into a frame portion along the outer edge and an electrode portion inside the frame portion. This segmentation reinforces the substrate structure by creating a rigid frame that prevents brittle fracture while maintaining the overall thin profile needed for small-size electronic devices.

Inventive Principle:

Principle #1Segmentation

2Strength

If the substrate is divided into multiple parts by a penetration portion, then the strength is improved through the frame portion, but the device complexity increases

Engineering Contradiction:

Improvestrength of thin-film capacitorVSAvoidcomplexity of substrate structure

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The substrate is segmented into functional regions (frame portion and electrode portion) by a penetration portion, which divides the substrate in the thickness direction. This segmentation provides structural reinforcement while maintaining a relatively simple manufacturing process by using standard thin-film fabrication techniques.

Inventive Principle:

Principle #1Segmentation

3Reliability

If an insulating resin is used to fill the penetration portion, then electric insulation between the frame portion and electrode portion is enhanced, but the manufacturing process becomes more complex

Engineering Contradiction:

Improveelectric insulationVSAvoidease of manufacturing

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

An insulating resin is introduced as an intermediary material to fill the penetration portion, providing electrical insulation between the frame portion and electrode portion. This approach ensures reliable electric insulation while allowing the use of conventional filling and curing processes that are compatible with existing manufacturing workflows.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS10340088B2Thin-film capacitor

Publication Date: 2019.07.02 TDK CORP

AI summary

In a thin-film capacitor, an electrode terminal layer is divided into a plurality of parts by a penetration portion, and includes a frame portion as one divided part. The frame portion is disposed along an outer edge of the electrode terminal layer when viewed from the bottom surface side of the electrode terminal layer, and the frame portion can hinder deformation of the electrode terminal layer stretching or warping in a thickness direction or an in-plane direction, whereby such deformation can be prevented. Accordingly, in the thin-film capacitor, the electrode terminal layer is not likely to be deformed and an improvement in strength thereof is achieved.