Multilayer Capacitor Frame Terminal Bonding for Thermal Stress Relief
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Solution Overview
Problem
Conventional multilayer capacitors face challenges in maintaining high reliability due to direct stress transfer from the mounting board, which leads to thermal stress and physical defects at the bonding interfaces caused by differences in coefficients of thermal expansion.
Innovation Solution
The electronic component design includes a multilayer capacitor with a frame terminal and a conductive bonding portion. The conductive bonding portion has a larger contact area with the frame terminal than with the external electrode, and it includes a base portion and protruding portions to manage thermal stress effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a frame terminal is bonded to the multilayer capacitor to block stress transfer from the board, then mechanical reliability is improved, but thermal stress is generated at the bonding interfaces due to difference in coefficients of thermal expansion
Solution Approach 1:
The conductive bonding portion is divided into a base portion and multiple protruding portions. The base portion bonds to the frame terminal while the protruding portions bond to the external electrode, segmenting the bonding interfaces to manage thermal stress distribution and prevent concentration at single interfaces.
Solution Approach 2:
Different portions of the conductive bonding portion have different contact areas: the base portion has a larger contact area with the frame terminal while the protruding portions have smaller contact areas with the external electrode. This local differentiation optimizes stress distribution across interfaces with different thermal expansion coefficients.
2Strength
If the conductive bonding portion has a large contact area with the external electrode, then bonding strength is improved, but thermal stress deterioration increases due to coefficient of thermal expansion difference
Solution Approach 1:
The bonding interface is segmented into two distinct locations: the base portion bonding to the frame terminal and the protruding portions bonding to the external electrode. This segmentation allows the larger contact area to be positioned at the base portion where it provides strength without concentrating thermal stress at a single interface.
Solution Approach 2:
The base portion of the conductive bonding portion acts as an intermediary between the frame terminal and the protruding portions. It receives the larger contact area for strength while transferring loads to multiple protruding portions that contact the external electrode, distributing thermal stress across multiple interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the deterioration of bonding interfaces due to thermal stress while maintaining strong bonding between the frame terminal and the multilayer capacitor, thus enhancing the reliability and durability of the electronic component.
Implementation Method 1
thermal stress caused by a difference in coefficients of thermal expansion between a multilayer capacitor and a conductive bonding portion
Data Source
AI summary
An electronic component according to an embodiment includes a multilayer capacitor, a frame terminal, and a conductive bonding portion. An area in which the conductive bonding portion contacts the frame terminal is larger than an area in which it contacts with the external electrode.