Multilayer Capacitor Frame Terminals with Coupling Holes

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Solution Overview

Problem

Multilayer capacitors face damage from thermal and mechanical deformation stress, and generate acoustic noise due to piezoelectric phenomena, limiting their durability and reliability in electronic devices.

Innovation Solution

A multilayer electronic component design featuring frame terminals with coupling holes and conductive adhesives that separate the capacitor from the mounting surface, reducing stress transmission and acoustic noise, while maintaining high capacitance and reliability through a quadrangular band shape bonding mechanism.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multilayer capacitors are mounted on boards through conductive resin or solder, then electrical connection is achieved, but thermal and mechanical deformation stress damages the capacitor or solder bonding portion

Engineering Contradiction:

Improvedurability against thermal and mechanical stressVSAvoidthermal and mechanical deformation stress

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces frame terminals with coupling holes as an intermediary structure between the multilayer capacitor and the mounting board. The external electrodes of the capacitor are inserted into the coupling holes and bonded to the inner surfaces, creating a buffer structure that isolates the capacitor from direct stress transmission. This intermediary structure absorbs and distributes thermal and mechanical stress, preventing direct damage to the capacitor body and solder bonding portions.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The frame terminal structure provides beforehand cushioning by creating a physical buffer zone between the capacitor and the mounting board. The coupling holes and bonding structure are designed to absorb stress before it reaches the capacitor, providing protective cushioning against thermal expansion and mechanical deformation that occurs during operation and mounting processes.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If voltage is applied to the dielectric layer, then polarization and piezoelectric phenomenon occur, but this generates residual polarization and vibration sound

Engineering Contradiction:

Improveelectrical functionVSAvoidacoustic noise

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The frame terminal structure acts as a mediator that physically isolates the multilayer capacitor from the mounting board. This isolation prevents the transmission of vibration sounds generated by the piezoelectric phenomenon to the board and surrounding components, reducing acoustic noise while maintaining the electrical function of the capacitor.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If the capacitor is separated from the mounting surface, then stress transmission is reduced, but mounting stability may be compromised

Engineering Contradiction:

Improvestress resistanceVSAvoidmounting stability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The frame terminal with coupling holes serves as a mediator that achieves both stress isolation and mounting stability. The coupling holes provide secure mechanical engagement for the external electrodes through bonding to inner surfaces, ensuring stable mounting, while the frame structure simultaneously acts as a buffer to reduce stress transmission to the capacitor body.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The frame terminal structure segments the mounting function from the stress transmission path. The coupling holes provide localized secure bonding points for stability, while the frame structure distributes and absorbs stress away from the capacitor, achieving both mounting stability and stress resistance through functional segmentation.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances durability and reliability by absorbing external stress, reducing acoustic noise, and maintaining high capacitance without increasing the component's size, thus addressing the limitations of existing mounting methods.

Implementation Method 1

A conductive adhesive may be applied between the band portions of the pair of external electrodes and the inner surfaces of the coupling holes.

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

a dielectric layer of the multilayer capacitor is formed of ferroelectrics, and thus, when a voltage is applied thereto, polarization occurs

Methodology Applied

Scientific EffectPolarization: Polarisation

Implementation Method 3

Due to the piezoelectric phenomenon, dipoles are displaced in synchronization with an applied voltage in a direction in which the dielectric layers are stacked through an aligning process and realigning process in a certain direction, generating a vibration sound.

Methodology Applied

Scientific EffectPiezoelectric phenomenon: Piezoelectric Effect

Data Source

PatentUS10580582B2Multilayer electronic component

Publication Date: 2020.03.03 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A multilayer electronic component includes a multilayer capacitor including a pair of external electrodes respectively formed on both ends opposing each other, and a pair of frame terminals having coupling holes allowing the external electrodes of the multilayer capacitor to be inserted, and separating the multilayer capacitor from a mounting surface, wherein band portions of the external electrodes are bonded to inner surfaces of the coupling holes.