Film Capacitor Heat Dissipation via Segmented Dielectric Shell
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing capacitors face inadequate thermal management due to inadequate heat transfer and dissipation, leading to reduced longevity and maximum power output, especially at elevated temperatures, where current ratings decline significantly.
Innovation Solution
A capacitor design featuring a dielectric shell surrounding interleaved winding members with conductive layers and axially extending holes for solder connection, allowing for efficient heat dissipation through a lead frame and optional heat sink modules for active thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional capacitor package design is used, then isolation from humidity is achieved, but heat dissipation is limited
Solution Approach 1:
The capacitor package is segmented into distinct functional zones: a sealed lower portion containing the winding members and dielectric shell for humidity isolation, and an exposed upper portion with the lead frame for heat dissipation. This segmentation allows simultaneous achievement of both humidity protection and thermal management.
Solution Approach 2:
The dielectric shell acts as an intermediary component that provides both electrical insulation and a barrier against humidity ingress, while the lead frame serves as a thermal intermediary that conducts heat from the internal windings to the external environment. The mounting lip structure mediates between the sealed and unsealed portions of the package.
2Power
If capacitor operates at elevated temperatures, then power output is maintained, but current rating drops significantly
Solution Approach 1:
The package design dynamically manages thermal characteristics by providing optimized heat dissipation pathways through the lead frame and mounting structure, allowing the capacitor to maintain stable operating temperatures and current ratings even when subjected to elevated ambient temperatures or high power dissipation conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances thermal energy dissipation, maintaining capacitance and current ratings, enabling reliable operation over a longer lifespan and increased power handling capacity.
Implementation Method 1
A capacitor design featuring a dielectric shell surrounding interleaved winding members with conductive layers and axially extending holes for solder connection, allowing for efficient heat dissipation through a lead frame
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A capacitor (100) comprises a first winding member (58), where the first winding member (58) comprises a first dielectric layer (56) and a first conductive layer (50). A second winding member (60) comprises a second dielectric layer (57) and second conductive layer (52). The first winding member (58) is interleaved, partially or entirely, with the second winding layer (60). A dielectric shell (24) or shell is adapted to at least radially contain or border the first winding member (58) and the second winding member (60). The first winding member (58) is electrically connected to a first conductive end (20). A second winding member (60) is electrically connected to a second conductive end (21). The second conductive (21) end is opposite the first conductive end (20). The first conductive end (20) forms a first lead; the second conductive end (21) forms a second lead.