Multilayer Capacitor Height-Width Ratio for Mounting Stability
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Solution Overview
Problem
Existing electronic component mounting structures face instability and significant acoustic noise due to the propagation of vibrations from multilayer capacitors to circuit boards, particularly when the component height exceeds its width, leading to unstable positioning and increased noise levels.
Innovation Solution
The electronic component design features a multilayer body with a configuration where the height of the capacitor element is not greater than its width, with a board terminal having a smaller width and length than the capacitor, and mounting electrodes that fully overlap the effective portion, reducing the propagation of vibrations through a minimized solder fillet and enhancing stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the height of the multilayer capacitor is increased to maintain electrostatic capacity, then the electrostatic capacity is improved, but the mounting position stability deteriorates
Solution Approach 1:
The patent changes the dimensional relationship between height and width of the multilayer capacitor. Instead of height being greater than width (conventional structure), the patent designs the capacitor so that height is less than or equal to width, effectively using dimensional reconfiguration to improve mounting stability while maintaining capacity through optimized electrode arrangement in the planar direction
2Object-generated harmful factors
If the capacitor conductor is located away from the circuit board to reduce acoustic noise, then acoustic noise is reduced, but the height of the electronic component increases
Solution Approach 1:
The patent extracts the capacitor conductor (effective portion) from direct contact with the circuit board by positioning it above the board terminal. The mounting structure separates the conductive element from the board surface, creating a suspended configuration that reduces vibration transmission to the circuit board while minimizing acoustic noise generation
3Reliability
If the height of the electronic component is larger than the width, then the electrostatic capacity is maintained, but the mounting position becomes unstable
Solution Approach 1:
The patent changes the geometric parameters of the multilayer capacitor, specifically setting the height to be less than or equal to the width (h ≤ w). This parameter inversion resolves the mounting stability issue while electrostatic capacity is maintained through optimized electrode area and dielectric properties in the revised dimensional configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the electronic component's position and significantly reduces acoustic noise by minimizing the vibration propagation path, thereby increasing mounting density and reducing audible noise.
Implementation Method 1
vibrations propagating from the multilayer capacitor through the solder fillet to the circuit board
Data Source
AI summary
An electronic component includes an electronic element including two outer electrodes on surfaces thereof and a board terminal including a board main body and two mounting electrodes. The board main body has electrical insulating properties and a first principal surface. The two mounting electrodes are disposed on the first principal surface and electrically coupled to the two outer electrodes, respectively. The electronic element is mounted on the first principal surface side. The two outer electrodes are partially disposed outside an outer edge of the board terminal when viewed from the first principal surface side. The height from an end of each of the two outer electrodes opposite the board terminal to an end of the board terminal opposite the electronic element is not greater than a larger dimension of the width of the electronic element and the width of the board terminal.