Capacitor Holder With Downward Lead For High Density Mounting
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Solution Overview
Problem
Conventional capacitor holders with bulky resin structures embedded with metal leads reduce package density when multiple capacitors are mounted in parallel, as the bulky portions interfere with adjacent capacitors, leading to increased spacing and decreased efficiency.
Innovation Solution
A capacitor holder design featuring a body part made of electrically insulating material and a metal lead part that is soldered to a predetermined location, positioned opposite to the capacitor, allowing for reduced lateral structure bulk and improved spacing between capacitors, while also providing capacitive coupling to mitigate high-frequency noise and secure the capacitor against vibration and shock.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metal leads are embedded in resin portion of holder body, then strength is improved, but holder structure becomes bulky
Solution Approach 1:
The lead part is repositioned from being embedded within the holder body to extending from the bottom surface in a downward direction, utilizing the vertical dimension below the holder body. This dimensional relocation eliminates the need for bulky resin portions while maintaining structural strength through proper lead positioning and soldering to the printed wiring board.
2Strength
If bulky resin structure is used to embed metal leads, then strength is improved, but package density decreases
Solution Approach 1:
The lead part extends downward from the bottom surface of the holder body, utilizing the vertical space below the holder rather than occupying lateral space within the holder body. This dimensional change eliminates the bulky resin structure requirement, allowing adjacent capacitors to be positioned closer together and improving package density while maintaining necessary strength through proper lead anchoring.
3Reliability
If lead part is positioned laterally adjacent to capacitor, then capacitive coupling is achieved, but spacing between capacitors increases
Solution Approach 1:
The lead part is positioned in the vertical dimension below the holder body rather than laterally adjacent to the capacitor. This downward extension maintains capacitive coupling to the capacitor case while eliminating lateral protrusion, thereby reducing the spacing required between adjacent capacitors and improving package density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances package density by reducing spacing between capacitors, effectively addresses high-frequency noise, and ensures secure mounting and protection against mechanical stress and potential rupture, maintaining optimal holding pressure regardless of capacitor tolerance.
Implementation Method 1
The lead part can be capacitively coupled to a case which is an exterior of the capacitor
Implementation Method 2
The body part has an abutment portion which abuts a tip end surface of the capacitor, when the tip end of the capacitor is fitted into the body part
Implementation Method 3
ensures secure mounting and protection against mechanical stress and potential rupture
Implementation Method 4
ensures secure mounting and protection against mechanical stress and potential rupture
Data Source
AI summary
A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.


