Capacitor Holder for Compact Onboard Power Source Thermal Management

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Solution Overview

Problem

Conventional onboard power supply devices face challenges in minimizing size due to the need to separate heat-generating components from capacitors to prevent thermal degradation, leading to increased volume and area requirements.

Innovation Solution

The use of a holder with a base part, holding parts, and a fixing part that securely fixes capacitors to a mounting board, where the holding parts act as a heat spreader and propagation path, allowing heat-generating components to be positioned close to capacitors while preventing concentrated heat propagation and ensuring uniform degradation of capacitors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If heat-generating components are separated from capacitors, then thermal degradation of capacitors is prevented, but the device size increases

Engineering Contradiction:
Improvecapacitor reliabilityVSAvoiddevice volume
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The holder is divided into multiple holding parts, each independently holding a capacitor. This segmentation allows capacitors to be positioned in a bundled configuration, reducing the overall device volume while maintaining thermal separation through the holder structure's heat spreading capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The holder acts as an intermediary component between the capacitors and the heat-generating components. It provides a bundled holding structure that facilitates heat spreading from concentrated sources, enabling closer positioning of heat-generating components while protecting capacitors from thermal degradation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of stationary object

If heat-generating components are positioned close to capacitors, then device size is reduced, but concentrated heat propagation degrades capacitors non-uniformly

Engineering Contradiction:
Improvedevice volumeVSAvoidcapacitor reliability
Core Design Contradiction:
Volume of stationary objectVSReliability

Solution Approach 1:

The holder structure provides localized heat management by bundling capacitors in a configuration that promotes uniform heat distribution. Each holding part is positioned to ensure equitable heat propagation paths, creating local thermal equilibrium that prevents non-uniform degradation while allowing compact device design.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The bundled holding structure creates homogeneous thermal conditions across all capacitors. By positioning capacitors in a bundled configuration with uniform spacing and thermal pathways through the holder, the system achieves homogeneous heat distribution, ensuring all capacitors degrade uniformly and maintain consistent performance.

Inventive Principle:
Principle #33Homogeneity

3Volume of stationary object

If capacitors are bundled in a holder, then device size is minimized, but stress distribution on capacitors becomes uneven

Engineering Contradiction:
Improvedevice volumeVSAvoidcapacitor stress distribution
Core Design Contradiction:
Volume of stationary objectVSStability of the object's composition

Solution Approach 1:

The holder is segmented into multiple holding parts, each independently supporting a capacitor. This segmentation distributes mechanical stress evenly across all capacitors in the bundle, preventing stress concentration on individual components while maintaining compact device dimensions through the bundled configuration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The bundled holding structure creates homogeneous mechanical support conditions for all capacitors. Each capacitor is held in a similar position and orientation within the holder, ensuring uniform stress distribution during device operation and vibration, thereby improving overall system stability and reliability.

Inventive Principle:
Principle #33Homogeneity

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the size of the onboard power supply device by enabling the placement of heat-generating components near capacitors while maintaining uniform degradation and enhancing reliability through balanced heat dissipation and stress distribution.

Implementation Method 1

the holding parts act as a heat spreader and propagation path, allowing heat-generating components to be positioned close to capacitors while preventing concentrated heat propagation

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS11515088B2Onboard power source device
Publication Date: 2022.11.29 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US11515088B2 patent drawing
  • US11515088B2 patent drawing
  • US11515088B2 patent drawing

AI summary

An onboard power supply device includes capacitors, a holder holding the capacitors, a mounting board having the capacitors mounted thereon and having the holder fixed thereto, and a heat-generating component mounted on the mounting board. Each of the capacitors includes a capacitor body and a lead terminal extending from the capacitor body. The holder includes a base part, first holding parts bundled by the base part and holding the capacitors, second holding parts each connected to a corresponding one of the first holding parts, and a fixing part extending from an outer edge of the base part toward the mounting board and fixed to the mounting board. The capacitor body of each of the capacitors is held by a corresponding one of the first holding parts. The lead terminal of each of the capacitors is held by a corresponding one of the second holding parts. The mounting board has a through-hole therein through which the lead terminal passes. The through-hole is connected to the lead terminal. The corresponding one of the second holding parts has a holding through-hole therein extending along a through-axis coinciding with the through-hole. An inner wall of the holding through-hole contacts the lead terminal. This onboard power supply device has a small size.