Capacitor Housing Case with Forward Terminal for Heat Dissipation
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Solution Overview
Problem
Capacitor housing cases for vehicles face challenges in heat dissipation and weight reduction, as they tend to overheat and require significant epoxy molding, which complicates assembly and increases weight, making them unsuitable for the vehicle lightweight trend.
Innovation Solution
A capacitor housing case with a unique design featuring a rear plate with a longitudinal division, a top plate, a bottom plate, and side plates forming a placement space with a front opening for epoxy molding, and conductive thermal-spraying planes on capacitor elements, along with busbar-formed portions and fixed mounts for enhanced heat dissipation and reduced epoxy usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional capacitor housing design is used, then sufficient epoxy molding can be achieved, but heat dissipation is poor and weight is excessive
Solution Approach 1:
The housing case is divided into multiple functional regions: a rear plate with longitudinal division creating first and second placement spaces, side plates with heat dissipation protrusions, and a bottom plate with recesses. This segmentation allows different areas to serve specialized functions - heat dissipation in protrusions, epoxy molding in recesses, and capacitor element placement in divided spaces - thereby improving heat dissipation while maintaining structural integrity and durability
Solution Approach 2:
The design adds vertical dimensionality with heat dissipation protrusions extending upward from the bottom plate and recesses forming depth variations. The rear plate's longitudinal division creates multi-level placement spaces. These dimensional additions increase surface area for heat dissipation without expanding the horizontal footprint, and provide epoxy reservoirs without increasing overall housing volume
2Reliability
If significant epoxy molding is used, then capacitor elements are well protected, but product weight increases
Solution Approach 1:
The design extracts epoxy molding from a bulk material filling approach to a targeted localized approach. Recesses in the bottom plate create specific cavities where epoxy is applied only where needed - around capacitor elements and busbars - rather than filling the entire housing volume. This extraction reduces epoxy quantity and weight while maintaining protective function in critical areas
Solution Approach 2:
The housing design incorporates void spaces and recesses that allow epoxy to be applied in a distributed, porous manner rather than as a solid block. The recesses in the bottom plate and spaces between capacitor elements create a porous epoxy distribution pattern that reduces overall epoxy volume while maintaining structural protection and thermal conduction pathways
3Weight of moving object
If housing shape is optimized for compactness, then weight is reduced, but heat dissipation capability is compromised
Solution Approach 1:
The design incorporates protrusions with curved surfaces that extend from the bottom plate. These curved heat dissipation protrusions increase surface area for thermal radiation and convection without significantly increasing the bounding box dimensions of the housing, thereby maintaining compactness while enhancing heat dissipation capability
Solution Approach 2:
The heat dissipation protrusions are nested within the overall housing structure rather than being external attachments. The recesses are integrated into the bottom plate geometry. This nesting approach adds heat dissipation surface area and epoxy molding volume without increasing the external dimensions of the housing, maintaining compact form factor while improving thermal management
4Ease of manufacture
If traditional housing structure is used, then assembly is straightforward, but transformation during cooling and epoxy molding causes accuracy issues
Solution Approach 1:
The housing design incorporates expansion compensation features built into the injection molding process. The rear plate with longitudinal division and side plates with protrusions are designed with predetermined expansion characteristics that anticipate cooling contraction. By pre-planning the geometry to accommodate thermal transformation, the final cooled housing maintains accurate dimensions and proper fit for capacitor elements and epoxy molding without requiring post-manufacturing adjustment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively minimizes epoxy molding, enhances heat dissipation, and maintains a compact shape, ensuring durability and ease of mounting while reducing weight, thus aligning with the vehicle lightweight trend and improving product accuracy and operability.
Implementation Method 1
capacitor elements 100, on which dielectric film is wounded, having conductive thermal-spraying plane at both sides
Data Source
AI summary
A capacitor housing case with output terminal withdrawn forward comprises: a rear plate for forming the placement space which is divided by division portion being projected longitudinally; a top plate which is vertically formed forward from a top of the rear plate; a bottom plate which is formed parallel to the top plate forward from a bottom of the rear plate; a side plate for forming the placement space having a front opening by coupling to both sides of the rear plate, a top plate and a bottom plate; and at least two fixed mount, which is exposed outside parallel to the rear plate, for having a fixation groove penetrating up and down; wherein a capacitor output terminal is extended through the front opening, and epoxy is inserted through the front opening, and the capacitor elements and the first, the second busbar-formed portion are epoxy molded.