Capacitor Component Indentation Structure Moisture Resistance

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Solution Overview

Problem

Multilayer ceramic capacitors face reliability issues due to moisture and plating solution permeation, leading to defects and performance deterioration, especially under high temperature/high pressure conditions.

Innovation Solution

A capacitor component design featuring dielectric layers with first and second internal electrodes laminated in a specific direction, covered by external electrodes with indentations at their boundaries, which are formed through adjustments in metal and glass content during the sintering process, enhancing moisture resistance and preventing plating solution permeation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the thickness of cover and electrode terminal is decreased to secure capacitance, then capacitance increases, but moisture resistance reliability deteriorates

Engineering Contradiction:
ImprovecapacitanceVSAvoidmoisture resistance reliability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies local quality by creating an indentation structure at specific locations (boundaries between internal electrodes and external electrodes) rather than uniformly throughout the component. This localized structural modification provides enhanced moisture resistance at critical interfaces without requiring overall thickening of the cover or electrode terminals, thus maintaining high capacitance while improving moisture resistance reliability.

Inventive Principle:
Principle #3Local quality

2Reliability

If plating process is performed to improve conductivity, then electrical performance improves, but plating solution permeation causes defects and reliability deterioration

Engineering Contradiction:
Improveelectrical performanceVSAvoidplating solution permeation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent implements preliminary anti-action by forming an indentation structure before the plating process that prevents plating solution from permeating into the internal structure. This pre-established barrier structure stops the harmful permeation before it can occur during plating, eliminating defects while still allowing the plating process to improve electrical conductivity on the external surfaces.

Inventive Principle:
Principle #9Preliminary anti-action

Data Source

PatentUS11239032B2Capacitor component
Publication Date: 2022.02.01 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11239032B2 patent drawing
  • US11239032B2 patent drawing
  • US11239032B2 patent drawing

AI summary

A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.