Capacitor-Inductor Circuit for Crack Detection in Multi-Layer Articles

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Solution Overview

Problem

Existing sensors struggle to effectively detect cracks and other defects in solid bodies before they lead to circuit failure, particularly in multi-layer articles where defects can propagate undetected.

Innovation Solution

The integration of circuits with an inductor and a capacitor, where the capacitor substantially surrounds the inductor, into the interlaminar region of multi-layer articles. This configuration allows for early detection of cracks and defects by maintaining circuit functionality even as defects propagate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If circuits are integrated into multi-layer articles for defect detection, then detection capability is improved, but circuit reliability deteriorates due to defect propagation leading to circuit failure

Engineering Contradiction:
Improvedefect detection capabilityVSAvoidcircuit reliability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The circuit is segmented into modular components (inductor, capacitor, interconnectors) that can be independently positioned and configured. This segmentation allows the capacitor to be strategically placed to surround the inductor, creating redundant detection zones that maintain circuit functionality even when defects propagate through certain areas.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The capacitor is configured to substantially surround the inductor in a nested arrangement. This nesting creates multiple detection zones where the capacitor's extended structure provides redundant sensing paths, ensuring that defect detection capability is maintained even if defects propagate through the inductor region.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Measurement precision

If capacitor is configured to substantially surround inductor, then detection precision is improved, but device complexity increases

Engineering Contradiction:
Improvedefect detection precisionVSAvoidcircuit configuration complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The capacitor and inductor are merged into a single integrated circuit unit with the capacitor surrounding the inductor. This combining of components into a compact nested structure achieves enhanced detection precision without proportionally increasing device complexity, as the components share common packaging and interconnection structures.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The nested capacitor-inductor configuration serves multiple functions simultaneously: the capacitor acts as both an electrical component and a structural detection element that surrounds the inductor. This multi-functionality reduces overall device complexity by eliminating the need for separate detection structures.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables the early detection of cracks and defects in solid bodies, preventing circuit failure and allowing for timely intervention to maintain structural integrity.

Implementation Method 1

a parallel-plate capacitor comprising a first electrode, a second electrode, and a non-conductive material between the first electrode and the second electrode

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 2

a circuit comprising an inductor and a capacitor electronically coupled to the inductor

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS20250052711A1Sensors and related systems and methods
Publication Date: 2025.02.13 ANALOG DEVICES INC
  • US20250052711A1 patent drawing
  • US20250052711A1 patent drawing
  • US20250052711A1 patent drawing

AI summary

The present disclosure is related to sensors, such as structural sensors, and related systems and methods.