Multilayer Capacitor Insulating Portions Vibration Damping
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Solution Overview
Problem
Multilayer capacitors generate acoustic noise and high-frequency vibrations due to piezoelectric properties, which can be misinterpreted as device malfunctions and deteriorate signal quality, especially when vibrations are transferred through solders to circuit boards.
Innovation Solution
A multilayer electronic component design featuring a capacitor body with external electrodes, land portions, and insulating portions that reduce acoustic noise in the audio frequency region and high-frequency vibrations by using conductive materials and insulating patterns to absorb and dissipate vibrations, thereby minimizing the transfer of piezoelectric vibrations to the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the volume and height of the solders are increased to improve electrical connection, then the vibrations of the multilayer capacitor are more easily transferred to the circuit board, such that a magnitude of the generated acoustic noise is increased
Solution Approach 1:
The patent introduces an insulating portion as an intermediary element positioned between the external electrode and the solder. This insulating portion acts as a mediator that blocks the transmission path of vibrations from the capacitor body to the solder and circuit board, while still allowing electrical connection to be maintained through the external electrode structure
Solution Approach 2:
The patent segments the external electrode structure by introducing an insulating portion that divides the continuous solder connection into separate sections. This segmentation interrupts the vibration transmission path while maintaining electrical connectivity through the external electrode, thereby reducing acoustic noise without compromising electrical connection reliability
2Quantity of substance
If a multilayer capacitor is used to achieve high capacitance density, then piezoelectric vibrations are generated in high frequency region of 20 kHz or more, which may cause malfunctions of various sensors
Solution Approach 1:
The insulating portion serves as a vibration isolation intermediary that specifically targets high-frequency vibrations (20 kHz or more) generated by the piezoelectric effect. It blocks these high-frequency vibrations from propagating to external sensors while maintaining the capacitor's high capacitance density performance
Solution Approach 2:
The patent converts the harmful high-frequency piezoelectric vibrations into a manageable issue by using the insulating portion to absorb and dissipate the vibration energy locally, preventing it from affecting external sensors while maintaining the beneficial high capacitance density characteristics of the multilayer capacitor
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces acoustic noise in the audio frequency region and high-frequency vibrations, preventing malfunctions and improving signal quality by minimizing the transfer of vibrations, thus enhancing the reliability and performance of electronic devices.
Implementation Method 1
a dielectric material may have piezoelectric properties that may cause deformation of the dielectric material in synchronization with a voltage applied thereto
Implementation Method 2
first and second insulating portions spaced apart from each other between the first and second external electrodes on the mounting surface of the capacitor body
Data Source
AI summary
A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.