Capacitor Interface Angle Control for Breakdown Voltage
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Solution Overview
Problem
Conventional electronic components with thin film capacitors have low breakdown voltage, limiting their electrical properties and requiring improvement.
Innovation Solution
The electronic component design features a substrate with a capacitor part that includes a first electrode, a dielectric film, an insulating film with controlled openings, and a second electrode, where the angle between the dielectric film and insulating film interfaces is maintained at no more than 22° to enhance breakdown voltage, allowing for increased electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulating film is formed with conventional methods, then the manufacturing process is simple, but the breakdown voltage is low
Solution Approach 1:
The patent applies parameter changes by precisely controlling the interface angle θ between the dielectric film and insulating film to be 22° or less. This angular parameter control fundamentally changes the electric field distribution at the interface, thereby increasing the breakdown voltage from conventional low levels to enhanced levels without altering the basic capacitor structure or materials.
Solution Approach 2:
The patent employs curvature principles by forming the insulating film interface with a specific angular curvature (θ ≤ 22°) rather than a straight or sharp interface. This curved interface geometry reduces electric field concentration and prevents field singularities, leading to improved breakdown characteristics while maintaining manufacturing feasibility through controlled deposition processes.
2Reliability
If the interface angle θ is increased, then the manufacturing tolerance is relaxed, but the breakdown voltage decreases
Solution Approach 1:
The patent establishes a specific parameter range (θ ≤ 22°) for the interface angle that optimizes the breakdown voltage. By defining this angular parameter and controlling it within this range during manufacturing, the patent achieves both high reliability and manufacturability, as the angle can be controlled through standard thin film deposition techniques without requiring extreme precision.
3Reliability
If the insulating film shape is optimized for breakdown voltage, then the electrical properties improve, but the capacitance control becomes more difficult
Solution Approach 1:
The patent changes the geometric parameter of the insulating film interface angle to θ ≤ 22°, which simultaneously achieves improved breakdown voltage and maintains ease of capacitance control. The angular parameter can be adjusted during film deposition without fundamentally changing the capacitor design, allowing capacitance to be controlled through traditional methods while achieving enhanced electrical properties.
Data Source
AI summary
This electronic component comprises a substrate; and a capacitor part provided on the substrate, the capacitor part includes a first electrode part provided on the substrate; a dielectric film covering the first electrode part; an insulating film that contacts the dielectric film and has an opening part; and a second electrode part that contacts an inner wall surface of the opening part of the insulating film and a surface of the dielectric film, and when the angle between a first interface between the dielectric film and the insulating film, and a second interface between the insulating film and the second electrode part is θ, θ is not more than 22°.