Capacitor Heat Dissipation via Interleaved Metallic Members
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Solution Overview
Problem
Capacitors in electronic assemblies often suffer from inadequate heat dissipation due to limited package design, which reduces the longevity and maximum power output of electronic circuits.
Innovation Solution
The design incorporates interleaved winding members with dielectric and conductive layers, a dielectric package, and strategically positioned metallic members and leads for enhanced heat dissipation, allowing thermal energy to be efficiently transferred from the capacitor to the ambient environment through a circuit board or enclosure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional capacitor package design is used, then the capacitor structure is simple and easy to manufacture, but the heat dissipation capability is insufficient
Solution Approach 1:
The capacitor package is segmented into multiple functional layers including dielectric layers, conductive layers, and metallic members, with each layer serving specific thermal and electrical functions. This segmentation allows optimized heat dissipation pathways while maintaining manufacturing feasibility through standardized layering processes.
Solution Approach 2:
Metallic members are introduced as intermediary elements between the conductive layers and the external environment, serving as thermal conduits that facilitate heat transfer from the capacitor core to the ambient environment or heat sink, thereby enhancing heat dissipation without fundamentally redesigning the entire package structure.
2Reliability
If inadequate heat dissipation is accepted, then the capacitor package design remains simple, but the longevity and maximum power output are reduced
Solution Approach 1:
The patent replaces traditional mechanical cooling structures with an integrated thermal management system where metallic members and conductive layers form inherent heat dissipation pathways within the capacitor structure itself, enabling passive thermal management that extends longevity and maintains power output without adding mechanical cooling components.
3Temperature
If metallic members and interleaved winding structure are added for heat dissipation, then heat dissipation capability is improved, but manufacturing complexity increases
Solution Approach 1:
The metallic members and conductive layers are designed to serve multiple functions simultaneously: electrical conduction, mechanical support, and thermal management. This multi-functionality reduces the need for separate dedicated cooling components, thereby improving heat dissipation efficiency while maintaining ease of manufacture through integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively increases the heat dissipation capabilities of capacitors, leading to improved reliability and power handling capacity of electronic assemblies by maintaining lower operating temperatures and extending their lifespan.
Implementation Method 1
A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer
Data Source
AI summary
A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.