Multilayer Capacitor Interposer Adhesive Bonding for Noise Reduction
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Solution Overview
Problem
Conventional electronic components using interposers for acoustic noise reduction in multilayer capacitors fail to secure adequate fixing strength during board mounting, leading to poor mounting and insufficient noise reduction.
Innovation Solution
An electronic component design featuring a multilayer capacitor with a capacitor body and interposer, where the interposer has grooves and external terminals with a bonding, mounting, and connection portions, and an adhesive is used between the external electrode and the bonding portion, with specific dimensions to ensure a high melting-point solder connection that balances noise reduction and fixing strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is disposed between a multilayer capacitor and a board to reduce acoustic noise, then acoustic noise is reduced, but fixing strength during board mounting is insufficient
Solution Approach 1:
An interposer is introduced as an intermediary component between the multilayer capacitor and the board. The interposer includes an interposer body with grooves and external terminals that connect to external electrodes, serving as a mediator that both reduces acoustic noise transmission and provides adequate fixing strength through its structural design and adhesive bonding.
Solution Approach 2:
The patent specifies precise dimensional parameters for the interposer and adhesive configuration. The ratio (L+T2²)/T1 must satisfy 1.55≤(L+T2²)/T1, where L is bonding portion length, T2 is adhesive fall height, and T1 is electronic component height. This parameter optimization ensures both noise reduction effectiveness and sufficient fixing strength.
2Strength
If adhesive amount is increased to improve fixing strength, then fixing strength is improved, but acoustic noise reduction effect is compromised
Solution Approach 1:
The patent precisely controls the adhesive quantity through the parameter T2 (height at which adhesive falls along the connection portion), with the constraint 1.55≤(L+T2²)/T1. This optimized adhesive amount achieves sufficient fixing strength while preventing excessive adhesive from compromising acoustic noise reduction by filling grooves or creating vibration paths.
Solution Approach 2:
The adhesive is applied in a controlled partial amount rather than excessive coverage. The adhesive falls along the connection portion to a specific height T2, providing just enough bonding strength without over-saturation that would fill the grooves and eliminate the acoustic noise reduction mechanism.
3Volume of moving object
If the multilayer capacitor size is reduced for compactness, then compactness is improved, but fixing strength and noise reduction become insufficient
Solution Approach 1:
The system is segmented into distinct functional components: a compact multilayer capacitor, an interposer with grooves for noise reduction, and controlled adhesive application. This segmentation allows the capacitor to be miniaturized while the interposer and adhesive configuration compensate for reduced fixing strength and noise reduction capability.
Solution Approach 2:
The patent applies the parameter constraint 1.55≤(L+T2²)/T1 to scale the interposer and adhesive dimensions proportionally with the reduced capacitor size. This ensures that even with a compact capacitor body (0.7mm height or less), the fixing strength and noise reduction performance remain sufficient through optimized dimensional relationships.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces acoustic noise while securing sufficient fixing strength, maintaining a certain level of noise reduction and preventing poor mounting by optimizing the adhesive's height and bonding area.
Implementation Method 1
An adhesive is provided between the external electrode and the bonding portion
Implementation Method 2
the dielectric layers have piezoelectric properties. Accordingly, when a direct current (DC) voltage or an alternating current (AC) voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may occur between the internal electrodes. As a result, the volume of a ceramic body is expanded and contracted depending on a frequency, to cause periodic vibrations.
Data Source
AI summary
An electronic components includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, an interposer including an interposer body and a pair of external terminals, and an adhesive; wherein the external terminal includes a bonding portion, a mounting portion, and a connection portion; wherein an adhesive is provided between the external electrode and the bonding portion, and falls along the connection portion of the external terminal; wherein 1.55≤(L+T22)/T1 in which T2 is a height at which the adhesive falls along the connection portion of each of the external terminals, L is a length of the bonding portion, and T1 is a height of the electronic component.