Multilayer Capacitor Interposer Adhesive Height Optimization
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Solution Overview
Problem
Existing electronic components using interposers to reduce acoustic noise from multilayer capacitors do not effectively secure fixing strength during board mounting, leading to poor mounting and inadequate noise reduction.
Innovation Solution
An electronic component design that includes a multilayer capacitor with a pair of external electrodes and an interposer, where the interposer has external terminals with bonding, mounting, and connection portions, and an adhesive made of high-melting point solder is used between the electrodes and terminals, with the adhesive's height along the connection portions optimized to secure fixing strength while reducing acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is disposed between a multilayer capacitor and a board to reduce acoustic noise, then acoustic noise is reduced, but fixing strength during board mounting is not ensured
Solution Approach 1:
The patent changes the physical parameters of the adhesive material by specifying a high melting point range (200°C to 450°C) and controlling the adhesive height ratio (t/T) between 0.04 and 0.80. These parameter changes enable the adhesive to provide sufficient bonding strength while maintaining acoustic noise reduction performance.
Solution Approach 2:
The patent uses a composite approach by combining the interposer structure with a specially formulated adhesive material that has both high melting point properties and appropriate viscosity characteristics. This composite solution ensures both mechanical strength and acoustic isolation.
2Strength
If adhesive height is increased to secure fixing strength, then fixing strength is improved, but acoustic noise reduction effect is compromised
Solution Approach 1:
The patent establishes an optimal range for the adhesive height parameter (t/T ratio between 0.04 and 0.80) that balances both fixing strength and acoustic noise reduction. This parameter optimization ensures that the adhesive provides sufficient mechanical bonding without compromising the acoustic isolation performance of the interposer.
3Strength
If a high-melting point solder is used as adhesive, then fixing strength is secured, but manufacturing complexity increases
Solution Approach 1:
The patent specifies a high melting point range (200°C to 450°C) for the adhesive material, which provides sufficient bonding strength while remaining compatible with standard electronic component manufacturing processes. This parameter selection balances performance requirements with manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively secures a predetermined level of fixing strength and reduces acoustic noise by optimizing the adhesive's height and composition, preventing separation of the multilayer capacitor and interposer while minimizing board mounting vibrations.
Implementation Method 1
An adhesive is provided between the external electrodes and the bonding portions
Implementation Method 2
The adhesive may be a high-melting point solder. The high-melting point solder may include at least one of antimony (Sb), cadmium (Cd), lead (Pb), zinc (Zn), aluminum (Al), and copper (Cu)
Data Source
AI summary
An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The external terminals include bonding portions, mounting portions, and connection portions disposed to connect the bonding portions and the mounting portions to each other. Adhesives are provided between the external electrodes and the bonding portion. A height at which the adhesives fall along the connection portions of the external terminals is defined as t and a height of the interposer is defined as T, t/T satisfies 0.04≤t/T≤0.80.