Multilayer Capacitor Interposer with Uneven Terminal Surface
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Solution Overview
Problem
Conventional electronic components with interposers fail to ensure adequate fixing strength while effectively reducing acoustic noise in multilayer capacitors, leading to defective mounting and discomfort due to vibratory sound.
Innovation Solution
An electronic component design incorporating a multilayer capacitor with an interposer featuring a conductive bonding agent and an uneven surface connection portion, where the interposer is shorter and thinner than the capacitor, with a specific length-to-thickness ratio and a modulus of 30 GPa or higher, and made of alumina, ensuring enhanced fixing strength and reduced acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional interposer is used to reduce acoustic noise, then acoustic noise is reduced, but fixing strength is not ensured causing defective mounting
Solution Approach 1:
The connection portion of the external terminal is designed with a locally different surface quality (roughness Ra≥0.5μm) compared to other portions. This local surface roughness enhancement specifically at the connection portion improves bonding strength without affecting other functional areas of the terminal, resolving the contradiction between noise reduction and mounting reliability.
Solution Approach 2:
The surface roughness parameter of the connection portion is changed to be 0.5μm or greater, which is specifically optimized for bonding strength. This parameter change in the adhesive bonding region ensures adequate fixing strength while maintaining the overall noise reduction function of the interposer structure.
2Object-affected harmful factors
If the interposer is made shorter and thinner to reduce acoustic noise, then acoustic noise is reduced, but fixing strength may be compromised
Solution Approach 1:
The external terminal exhibits local quality differentiation where the connection portion has enhanced surface roughness (Ra≥0.5μm) specifically at the bonding interface. This localized surface enhancement compensates for the reduced overall size of the interposer, ensuring adequate fixing strength despite the shorter and thinner design that reduces acoustic noise.
Solution Approach 2:
The external terminal is formed as a composite structure combining a ceramic substrate with a metal external terminal layer. This composite construction provides both the mechanical strength needed for adequate fixing and the acoustic isolation properties required for noise reduction in a compact form factor.
3Strength
If the connection portion has an uneven surface with high roughness, then bonding strength is improved, but manufacturing precision may be affected
Solution Approach 1:
The uneven surface with high roughness (Ra≥0.5μm) is applied only to the connection portion of the external terminal, not the entire surface. This localized roughness treatment maintains manufacturing precision for critical dimensions while providing enhanced bonding strength only where adhesive bonding occurs, resolving the contradiction between bonding strength and overall manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a significant enhancement in fixing strength and a substantial reduction in acoustic noise, with the uneven surface and conductive bonding agent providing a secure grip and minimizing vibrations, while maintaining effective noise reduction.
Implementation Method 1
a conductive bonding agent is disposed between the external electrode and the bonding portion of the external terminal
Implementation Method 2
the dielectric layers have piezoelectric properties, and thus, when a direct current (DC) or alternating current (AC) voltage is applied to the multilayer capacitor, a piezoelectric phenomenon may occur between the internal electrodes to make a capacitor body expand and contract in volume according to frequencies, causing periodic vibrations
Implementation Method 3
an adhesive layer formed as the conductive bonding agent is hardened extends to a portion of the uneven surface of the external terminal. Roughness (Ra) of the uneven surface of the connection portion may be 0.5 μm or greater
Implementation Method 4
A modulus of the interposer may be 30 GPa or higher
Data Source
AI summary
An electronic component includes a multilayer capacitor including a capacitor body and an external electrode disposed at an end of the capacitor body, and an interposer including an interposer body and an external terminal disposed at an end of the interposer body. The external terminal includes a bonding portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a connection portion disposed on an end surface of the interposer body to connect the bonding portion and the mounting portion and having an uneven surface, and a conductive bonding agent is disposed between the external electrode and the bonding portion of the external terminals, and an adhesive extends to a portion of the uneven surface.