Laminate Block Rolling for Ceramic Capacitor Singulation
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Solution Overview
Problem
The existing methods for manufacturing laminated ceramic capacitors face challenges in downsizing and increasing capacity due to defects caused by shear forces during the cutting process, leading to yield deterioration and reliability issues, especially when ceramic green sheets and conductive patterns are thinned.
Innovation Solution
A method involving the preparation of a mother block with dielectric and conductive patterns, followed by singulating it into elongated rectangular parallelepipeds, rolling the blocks to change their orientation, and then cutting them into smaller rectangular chips along a direction perpendicular to the lamination direction to minimize shear force impact, using a stage and rolling mechanism to facilitate efficient handling and cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If push cutting is performed along the lamination direction to divide the mother block, then the cutting process is simple and efficient, but shear force causes peeling-off at the end portion of the ceramic green sheet and deformation of the conductive pattern
Solution Approach 1:
The patent applies inversion by changing the cutting direction from parallel to perpendicular relative to the lamination direction. Instead of cutting along the lamination direction (conventional method), the blade now cuts perpendicular to it, which eliminates the shear force problem while maintaining cutting efficiency. This directional inversion resolves the contradiction between productivity and reliability.
Solution Approach 2:
The patent changes the critical parameter of cutting direction angle from 0 degrees (parallel to lamination) to 90 degrees (perpendicular to lamination). This parameter change transforms the shear force mechanism into a clean perpendicular cut, preventing peeling-off and pattern deformation while maintaining high cutting efficiency.
2Volume of moving object
If the ceramic green sheet and conductive pattern are thinned to achieve downsizing, then the capacitor size is reduced and capacity is increased, but the shear force during cutting causes more severe peeling-off and deformation
Solution Approach 1:
By inverting the cutting direction to be perpendicular to the lamination direction, the patent eliminates shear force application to the thinned ceramic green sheet and conductive pattern. This prevents peeling-off and deformation even when the materials are considerably thinned, thereby maintaining high manufacturing precision while achieving downsizing.
Solution Approach 2:
The patent changes the cutting direction parameter to perpendicular orientation, which fundamentally alters the stress distribution during cutting. This parameter change ensures that thinned materials maintain their structural integrity and cut surface quality, preventing defects that would otherwise occur with conventional cutting methods.
3Reliability
If push cutting is performed perpendicular to the lamination direction to suppress shear force, then peeling-off and pattern deformation are prevented, but the cutting process becomes more complex and less efficient
Solution Approach 1:
The patent applies inversion by adopting the perpendicular cutting direction, which initially appears to reduce efficiency but actually maintains high productivity. The inversion of cutting orientation eliminates the need for complex pre-processing steps and repositioning, thereby achieving both high reliability and maintained productivity.
4Quantity of substance
If techniques are applied to narrow dielectric layers at side surfaces to increase effective area, then capacity is increased, but shear force during cutting causes conductive patterns to come into contact and lose electrical isolation
Solution Approach 1:
By inverting the cutting direction to perpendicular orientation, the patent eliminates shear force that would cause conductive pattern deformation and contact. This maintains electrical isolation between patterns while allowing the dielectric layers to be narrowed for increased effective area and capacity.
Solution Approach 2:
The patent changes the cutting direction parameter to perpendicular orientation, which prevents shear-induced pattern deformation. This parameter change ensures that conductive patterns maintain their intended geometry and electrical isolation, even when dielectric layers are narrowed to increase effective area.
Data Source
AI summary
A method for manufacturing a capacitor element includes singulating a mother block into a plurality of laminate blocks having a shape of an elongated, substantially rectangular parallelepiped, by dividing the mother block in rows; rolling each of the plurality of laminate blocks; and singulating each of the plurality of laminate blocks into a plurality of laminate chips having a shape of a substantially rectangular parallelepiped, by dividing the plurality of laminate blocks after rolling in columns. The step of rolling each of the plurality of laminate blocks includes the step of moving the plurality of laminate blocks placed on a stage, along a direction in which the plurality of laminate blocks are arranged side by side, thereby sequentially pushing each of the plurality of laminate blocks to an end portion of the stage and causing each of the plurality of laminate blocks to rotationally fall from the end portion.