Capacitor Layer Module With Through-Hole Conductor for Low Wiring Loss
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Solution Overview
Problem
Existing technologies fail to effectively address the issue of connection distance between the voltage regulator and the load, leading to increased wiring losses and the inability to downsize semiconductor devices due to the distance between the voltage regulator and the load.
Innovation Solution
A module with a capacitor layer and through-hole conductor that electrically connects the voltage regulator and load, reducing the connection distance and minimizing wiring losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the connection distance between voltage regulator and load is increased, then the device can be mounted on larger package board, but wiring loss increases
Solution Approach 1:
The invention transitions from planar surface mounting to three-dimensional vertical stacking. Multiple functional layers (capacitor layer, regulator layer, load layer) are arranged in the thickness direction, allowing electrical connections through through-hole conductors that penetrate vertically through the package board. This dimensional change enables short connection distances despite large package board area, resolving the contradiction between available mounting area and wiring loss.
2Loss of energy
If the connection distance between voltage regulator and load is shortened, then wiring loss is reduced, but device downsizing becomes difficult
Solution Approach 1:
By utilizing the thickness direction for vertical layering and through-hole connections, the invention achieves short horizontal connection distances while maintaining overall device volume. The functional components are distributed across multiple layers stacked vertically, allowing compact footprint without increasing connection distance, thus resolving the contradiction between wiring loss reduction and device downsizing.
Solution Approach 2:
The invention embeds multiple functional layers within the package board structure. The capacitor layer, regulator layer, and load layer are nested vertically, with through-hole conductors penetrating through the layers to establish electrical connections. This nested configuration allows short connection distances between functional components while maintaining compact overall device volume.
3Quantity of substance
If capacitors are arrayed using conventional methods, then capacitor capacity is increased, but connection distance between voltage regulator and load cannot be shortened
Solution Approach 1:
Instead of arraying capacitors horizontally on the surface, the invention places capacitor elements within the capacitor layer in the thickness direction, with their terminals connected to through-hole conductors. This vertical arrangement allows multiple capacitors to be integrated without increasing horizontal connection distances between the voltage regulator and load, resolving the contradiction between capacitor capacity and connection distance.
Data Source
AI summary
A module is used in a semiconductor composite device that supplies a direct-current voltage adjusted by a voltage regulator including a semiconductor active element to a load. The module includes a capacitor layer including at least one capacitor portion forming a capacitor, a connection terminal used for electrical connection with at least one of the voltage regulator and the load, and a through-hole conductor formed to penetrate the capacitor portion in a thickness direction of the capacitor layer. The capacitor is electrically connected to at least one of the load and the voltage regulator with the through-hole conductor interposed between the load and the voltage regulator.