Capacitor-Like Heat Slug for Thermal and Electrical Performance
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Solution Overview
Problem
Existing semiconductor packages face challenges in improving both thermal and electrical characteristics, as heat slugs primarily focus on thermal management and neglect electrical performance.
Innovation Solution
Incorporating a heat slug with a capacitor-like structure, featuring conductors separated by a dielectric, and through mold vias that electrically connect the heat slug to both the substrate and semiconductor chips, enhancing electrical connectivity and capacitance for improved thermal and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat slugs are used to improve thermal characteristics, then thermal dissipation is enhanced, but electrical characteristics remain insufficient
Solution Approach 1:
The heat slug is transformed into a multi-functional component by adding capacitor-like structures (conductive layers with dielectric) that provide both thermal dissipation and electrical functions (capacitance, ESD protection, power integrity). The same structure serves dual purposes: heat conduction and electrical performance enhancement.
Solution Approach 2:
The patent merges the heat slug structure with capacitor structures by integrating conductive layers and dielectric materials within the heat slug. This combination creates a unified component that simultaneously addresses thermal management and electrical characteristics without requiring separate elements.
2Reliability
If through mold vias are added to connect heat slug to substrate, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
The through mold vias serve multiple functions: they provide electrical connection between the heat slug and substrate, support the capacitor structure, and facilitate heat transfer pathways. This multi-functionality reduces the need for additional separate components.
Solution Approach 2:
The electrical connection path is segmented into multiple vias (first via, second via) that are distributed throughout the structure, allowing independent optimization of electrical and thermal pathways while maintaining modularity in the design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal dissipation, resistance to electrostatic discharge (ESD), power integrity (PI), and signal integrity (SI), allowing semiconductor packages to operate effectively at high speeds and reduce electromagnetic interference (EMI).
Implementation Method 1
Heat slugs may absorb heat from semiconductor chips and/or packages in order to radiate the heat
Implementation Method 2
Heat slugs may absorb heat from semiconductor chips and/or packages in order to radiate the heat
Implementation Method 3
a heat slug on the molding layer having a capacitor-like structure where a dielectric is provided between conductors
Implementation Method 4
a heat slug on the molding layer having a capacitor-like structure where a dielectric is provided between conductors
Implementation Method 5
a through mold via electrically connecting the heat slug to the substrate
Data Source
AI summary
A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate.