Capacitor Component With Local Quality Dielectric Spacing
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving miniaturization and high capacitance while maintaining withstand voltage characteristics, as dielectric layer thickness reduction below 0.6 μm leads to insulation resistance deterioration and quality issues.
Innovation Solution
The capacitor component design includes dielectric layers and internal electrodes with specific spacing ratios (l2/l1 > 1 and l4/l3 ≤ 0.99) to enhance withstand voltage characteristics, achieved by controlling sintering conditions and layer thickness, particularly in the outer side portions to maintain shape and improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dielectric layer thickness is reduced below 0.6 μm to achieve miniaturization and high capacitance, then the number of stacked dielectric layers and internal electrodes increases, but withstand voltage characteristics deteriorate and insulation resistance decreases
Solution Approach 1:
The patent applies local quality by creating different dielectric layer thicknesses at different locations. The central portion maintains a first thickness while outer side portions have a second thickness greater than the first. This allows the outer regions to provide enhanced withstand voltage characteristics while the overall structure achieves miniaturization and high capacitance through increased stacking density in the central region.
Solution Approach 2:
The dielectric layers are segmented into different thickness zones - a central portion with thinner dielectric layers for high capacitance density and outer side portions with thicker dielectric layers for withstand voltage protection. This segmentation allows each region to optimize its function independently, resolving the contradiction between miniaturization and reliability.
2Quantity of substance
If dielectric layer thickness is reduced to increase the number of stacked layers, then capacitance increases, but insulation resistance deterioration and quality defects increase
Solution Approach 1:
Different regions of the capacitor are assigned different dielectric thicknesses to address quality concerns. The outer side portions have thicker dielectric layers that provide better insulation resistance and reduce quality defects, while the central portion maintains thinner layers to maximize the number of stacked layers and capacitance.
Solution Approach 2:
The thicker dielectric layers in the outer side portions act as a protective cushion against insulation resistance deterioration and quality defects. This preemptive design ensures that even if manufacturing variations occur, the outer regions provide a safety margin that maintains overall component quality and reliability.
3Volume of moving object
If dielectric layer thickness is continuously thinned to achieve miniaturization, then device size decreases, but shape maintenance becomes difficult and reliability deteriorates
Solution Approach 1:
The patent uses local quality by making the dielectric layers thicker in the outer side portions compared to the central portion. This differential thickness design provides structural support at the boundaries where shape maintenance is most critical, while allowing the central region to be miniaturized for high capacitance density. The thicker outer layers act as structural reinforcement that maintains overall component shape.
Data Source
AI summary
A capacitor component in which in a cross section (a L-T cross section) of a body in length and thickness directions, a distance between internal electrodes in a central portion of the body is closer than a distance between the internal electrodes in ends of the internal electrodes, and in a cross section (a W-T cross section) of the body in width and thickness directions, a distance between the internal electrodes in a central portion of the body is farther than a distance between the internal electrodes in ends of the internal electrodes may be provided.