Low-Inductance Capacitor Connection Features
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Solution Overview
Problem
Existing electrical connections between electronics modules and modular capacitors often result in high inductance, leading to voltage and current overshoot during switching events, which can negatively impact the performance of power semiconductor switching devices.
Innovation Solution
A modular capacitor design with conductive connection pads and an inactive material that provides thermal insulation and mechanical coupling, allowing for a low-inductance connection by minimizing stray inductance through overlapping conductive sections and air gaps, enabling stable and efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical connections are used between electronics modules and modular capacitors, then the connection structure is simple, but high inductance results leading to voltage and current overshoot during switching events
Solution Approach 1:
The connection structure is segmented into multiple functional components: connection pads with planar contact surfaces, inactive material layers for thermal insulation, and air gaps for mechanical coupling. This segmentation allows each component to optimize for its specific function while collectively achieving low-inductance performance without excessive overall complexity
Solution Approach 2:
The connection pads are designed with planar contact surfaces that are offset in directions orthogonal to the sidewalls, creating a three-dimensional arrangement. This dimensional approach minimizes stray inductance by optimizing the spatial configuration of conductive paths, reducing the loop area for current flow
2Device complexity
If connection pads are placed close together to reduce inductance, then inductance is reduced, but thermal management becomes difficult due to heat generation from high currents
Solution Approach 1:
Inactive material is introduced as an intermediary layer between the connection pads and the active capacitor dielectric material. This intermediate layer provides thermal insulation, preventing heat from the high-current connection pads from transferring to the sensitive dielectric material, thus enabling close pad placement without thermal damage
Solution Approach 2:
The capacitor structure employs composite material construction with distinct functional layers: conductive connection pads, thermally insulating inactive material, and active capacitor dielectric material. This composite approach allows optimization of each material for its specific function while working together to solve both electrical and thermal challenges
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a low-inductance connection that steepens switching edges without increasing voltage or current overshoot, enhancing the performance of semiconductor devices by providing a stable and efficient electrical link between the electronics module and the modular capacitor.
Implementation Method 1
the inactive material comprises a thermally insulating material, and the inactive material is configured as a thermal insulation barrier between the undersides of the first and second conductive connection pads and the active capacitor dielectric material
Implementation Method 2
an active capacitor dielectric material disposed within the housing and being configured as a dielectric medium between the internal electrodes
Data Source
AI summary
A capacitor includes an electrically insulating housing that encloses an interior volume, first and second conductive connection pads that are each configured as externally accessible points of electrical contact to internal electrodes of the capacitor that are disposed within the housing, and an active capacitor dielectric material disposed within the housing and being configured as a dielectric medium between the internal electrodes, the first conductive connection pad having a first planar contact surface that is substantially parallel to a first sidewall of the housing, the second conductive connection pad having a second planar contact surface that is substantially parallel to the first sidewall, the first and second planar contact surfaces being offset from one another in a direction that is orthogonal to the first sidewall.