Multilayer Capacitor Layout Balancing Capacitance and Moisture Resistance
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in securing moisture resistance and withstand voltage reliability due to reduced thickness of dielectric layers and internal electrodes, which can lead to moisture penetration and reduced capacitance performance.
Innovation Solution
A multilayer electronic component design with specific dimensions and configurations, including alternately disposed dielectric layers and internal electrodes, side margin portions, and cover portions, optimized to improve capacitance and reliability, where the average thickness of internal electrodes is greater than that of dielectric layers, and the proportions of these components are adjusted to ensure effective moisture resistance and capacitance per unit volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of dielectric layer and internal electrodes is reduced to decrease component size, then the component size is reduced, but moisture resistance reliability and withstand voltage reliability deteriorate
Solution Approach 1:
The patent divides the component into distinct functional regions: a capacitance forming portion with reduced thickness for miniaturization, and cover portions with greater thickness for moisture and voltage protection. This segmentation allows different regions to serve different purposes - the thinner capacitance portion reduces overall size while the thicker cover portions maintain reliability
Solution Approach 2:
The patent applies different thickness characteristics to different parts of the component. The capacitance forming portion has reduced thickness to minimize size, while the cover portions have increased thickness to provide moisture resistance and withstand voltage protection. This local differentiation of quality resolves the contradiction between size reduction and reliability maintenance
2Volume of moving object
If the thickness of dielectric layer and internal electrodes is reduced to decrease component size, then the component size is reduced, but capacitance performance deteriorates
Solution Approach 1:
The patent compensates for reduced thickness in one dimension by expanding the lateral dimensions of the capacitance forming portion. By increasing the area of the internal electrodes and dielectric layers in the planar direction, the capacitance is maintained despite the reduced thickness, thus achieving miniaturization without sacrificing capacitance performance
3Quantity of substance
If side margin is formed to improve capacitance, then capacitance is improved, but moisture penetration increases
Solution Approach 1:
The patent applies different structural characteristics to different regions: the side margin portion has a structure optimized for capacitance formation, while the cover portions have enhanced thickness and structure specifically for moisture protection. This local differentiation allows the side margin to improve capacitance without compromising moisture resistance, as the cover portions provide the necessary protection
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed alternately with the dielectric layer in a first direction; a first side margin portion and a second side margin portion disposed on opposing side surfaces of the body; a first external electrode and a second external electrode disposed on opposing end surfaces of the body. When an average size of the first side margin portion is defined as W1, an average size of the second side margin portion is defined as W2, and an average size between external surfaces of the first and second side margin portions is defined as W0, (W1+W2)/W0<0.20 is satisfied, and when an average thickness of the dielectric layer is defined as td and an average thickness of the internal electrode is defined as te, te>td is satisfied.