Capacitor Membrane Encapsulant Thickness Control
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Solution Overview
Problem
Existing capacitor designs face inefficiencies in volumetric efficiency due to the need for significant separation between anode and cathode components, leading to increased size and reduced capacitance per unit volume, while also posing challenges in miniaturization and compatibility with industry standards.
Innovation Solution
The use of membrane layers between the capacitive elements and the external surface of the encapsulant to control the thickness of the encapsulant, allowing for reduced volume occupation and improved attachment methods for anode and cathode leads, such as metalized holes for electrical connections, to enhance volumetric efficiency without compromising electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If significant separation distance is provided between anode lead and cathode layers to prevent electrical arcing, then electrical reliability is improved, but volumetric efficiency deteriorates
Solution Approach 1:
The patent introduces an encapsulant material as an intermediary substance between the anode lead and cathode layers. This encapsulant provides electrical insulation and physical separation, preventing arcing while occupying minimal space. The encapsulant acts as a mediator that enables close proximity of electrodes without direct contact, thus maintaining reliability while improving volumetric efficiency.
Solution Approach 2:
The patent employs a thin encapsulant layer that provides sufficient electrical insulation between conductive elements. This thin film approach replaces traditional bulky separation structures, maintaining the necessary electrical isolation while minimizing the volume consumed by separation requirements.
2Strength
If anode lead attachment area is increased to ensure secure connection, then mechanical strength is improved, but volumetric efficiency deteriorates
Solution Approach 1:
The patent applies local quality by concentrating the attachment area at specific locations rather than distributing it broadly. The anode lead makes contact with the anode at localized regions with high contact pressure and optimized geometry, providing sufficient mechanical strength without requiring extensive attachment area that would reduce volumetric efficiency.
Solution Approach 2:
The patent transitions from planar attachment to three-dimensional attachment structures. By utilizing vertical positioning and angled configurations of the anode lead relative to the anode surface, the attachment achieves sufficient strength through spatial optimization rather than increased surface area, thereby preserving volumetric efficiency.
3Object-affected harmful factors
If encapsulant thickness is increased to provide adequate shielding from weld operations, then protection of dielectric and cathode layers is improved, but volumetric efficiency deteriorates
Solution Approach 1:
The patent uses a thin encapsulant film that provides adequate shielding from weld operations through its material properties rather than its thickness. The encapsulant material is selected to have sufficient thermal and electrical resistance to protect the dielectric and cathode layers from weld-induced damage, while maintaining minimal thickness to preserve volumetric efficiency.
Solution Approach 2:
The patent changes the material parameters of the encapsulant to achieve better protection with reduced thickness. By selecting materials with superior thermal conductivity, electrical resistance, or thermal stability, the encapsulant provides adequate shielding from weld effects while occupying less volume, thus improving volumetric efficiency.
Data Source
AI summary
An improved capacitor is provided wherein the capacitor has improved volumetric efficiency. The capacitor comprises a capacitive element comprising an anode, a dielectric on the anode and a cathode on the dielectric. An encapsulant at least partially encases the capacitive element wherein the encapsulant comprises at least one membrane between the capacitive element and an external surface of the encapsulant.