Capacitor Metal Oxide Barrier Moisture Permeation

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Solution Overview

Problem

Multilayer ceramic capacitors face challenges in maintaining moisture resistance reliability due to permeation of plating solutions and external moisture, which can lead to defects and failures during high temperature/high pressure conditions.

Innovation Solution

A capacitor component design featuring a body with dielectric layers, internal electrodes, and external electrode layers, where metal oxides are applied on the boundaries between the electrode layers and plating layers, and indentations are strategically placed to reduce moisture permeation and enhance reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the thickness of cover and electrode terminal is decreased to secure capacitance, then capacitance is improved, but moisture resistance reliability deteriorates

Engineering Contradiction:
ImprovecapacitanceVSAvoidmoisture resistance reliability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

A glass layer is introduced as an intermediary substance between the internal electrode and the external environment. This glass layer acts as a barrier that prevents moisture permeation while allowing the electrode terminal thickness to be reduced for higher capacitance. The glass layer mediates between the conflicting requirements of thin electrodes for capacitance and thick protective layers for moisture resistance.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If plating process is performed to improve electrode terminal characteristics, then electrical conductivity is improved, but plating solution permeation causes defects and reliability deterioration

Engineering Contradiction:
Improveelectrode terminal characteristicsVSAvoidplating solution permeation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The glass layer is applied in advance before the plating process. This preliminary action creates a protective barrier that prevents plating solution from permeating into the internal electrode during the subsequent plating process. By performing this protective coating before plating, the harmful permeation is prevented while still allowing the plating process to improve electrode terminal characteristics.

Inventive Principle:
Principle #10Preliminary action

3Quantity of substance

If effective margin is decreased to increase capacitance, then capacitance is improved, but structural integrity deteriorates leading to moisture permeation

Engineering Contradiction:
ImprovecapacitanceVSAvoidstructural integrity
Core Design Contradiction:
Quantity of substanceVSStrength

Solution Approach 1:

The glass layer serves as a mediator that compensates for the reduced structural margin. By introducing this additional protective layer, the effective margin for moisture resistance is restored even though the cover and electrode terminal thicknesses have been reduced to increase capacitance. The glass layer makes up for the structural integrity loss.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11657978B2Capacitor component
Publication Date: 2023.05.23 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11657978B2 patent drawing
  • US11657978B2 patent drawing
  • US11657978B2 patent drawing

AI summary

A capacitor component includes a body including a dielectric layer, a first electrode and a second internal electrode, laminated in a first direction, opposing each other, and a first cover portion and a second cover portion, disposed on outermost surfaces of the first and second internal electrodes, each having a thickness of 25 μm or less, a first electrode layer and a second electrode layer, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and respectively, and plating layers, respectively disposed on the first and second electrode layers. A metal oxide is disposed on a boundary between the first electrode layer and the plating layer and a boundary between the second electrode layer and the plating layer.