Capacitor Metal Plate Insert Molding for Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional case-molded capacitors face issues with heat dissipation and thermal shock, leading to potential separation of the metal plate from the case due to differential coefficients of linear expansion, which can cause adhesion deterioration and separation during temperature changes.

Innovation Solution

A capacitor design featuring a metal plate insert molded in the case with a covered portion along its perimeter, where the main plate portion has an exposed outer surface and the covered portion is concealed by the case's peripheral portion, maintaining the metal plate's position within the case even under thermal stress and facilitating effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal plate is insert molded in the case to improve heat dissipation, then heat dissipation is improved, but the metal plate may separate outward from the case due to differential thermal expansion

Engineering Contradiction:

Improveheat dissipationVSAvoidadhesion between metal plate and case

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The metal plate is designed with differentiated regions: a main plate portion with exposed outer surface for heat dissipation and a covered portion along the perimeter that is concealed by the case. This local differentiation allows the exposed portion to perform thermal function while the covered portion maintains structural adhesion and prevents separation during thermal expansion

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The metal plate is segmented into functionally distinct regions: the main plate portion for heat dissipation and the covered portion for structural stability. This segmentation allows each region to perform its specific function optimally while reducing overall stress concentration that could lead to separation

Inventive Principle:

Principle #1Segmentation

2Temperature

If the metal plate is fully exposed to improve heat dissipation surface area, then heat dissipation is improved, but the metal plate becomes more prone to separation and adhesion deterioration

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidthermal shock and separation risk

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The metal plate structure implements local quality differentiation where the central main plate portion is exposed for maximum heat dissipation while the peripheral covered portion remains concealed for adhesion stability. This resolves the contradiction by optimizing each region's function rather than uniformly exposing the entire plate

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration prevents the metal plate from separating outward from the case, ensuring reliable adhesion and enhanced heat dissipation through the metal plate's higher thermal conductivity, while maintaining insulation and reducing the capacitor's size.

Implementation Method 1

enhanced heat dissipation through the metal plate's higher thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

separation of the metal plate from the case due to differential coefficients of linear expansion

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 3

Heat generated by the capacitor element in such a capacitor is not easily dissipated out of the case

Methodology Applied

Scientific EffectThermal shock: Thermal Shock

Data Source

PatentUS11587733B2Capacitor

Publication Date: 2023.02.21 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A capacitor includes a capacitor element, a case that houses the capacitor element and contains a resin, a metal plate insert molded in the case, and a filler resin filled in the case. The metal plate includes a main plate portion and a covered portion disposed along a perimeter of the main plate portion. The main plate portion has an outer surface exposed outwardly from an opening of the case. The covered portion has an outer surface covered by a peripheral portion of the case, the peripheral portion being disposed around the opening.