Capacitor Metallization Process for Sub-3 mΩ Resistance Control
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Solution Overview
Problem
Existing capacitor processing methods struggle to control capacitor resistance effectively and require welding a tin-copper conductive sheet, which is not suitable for all scenarios, especially for thinner capacitors.
Innovation Solution
A capacitor manufacturing process that involves electroplating a capacitor base layer, vacuum plating a metal layer, and electroplating a metal outer layer to control capacitor resistance without welding a tin-copper conductive sheet.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If welding a tin-copper conductive sheet is used to control capacitor resistance, then capacitor resistance can be controlled to be less than 3 milliohms, but the process complexity increases and thinner capacitors cannot be processed
Solution Approach 1:
The patent merges the capacitor body and conductive layer into a single integrated structure. The capacitor body itself is made conductive through metal layer deposition on both surfaces, eliminating the need for separate tin-copper conductive sheets. This integration reduces process complexity while maintaining resistance control below 3 milliohms.
Solution Approach 2:
The patent extracts and eliminates the separate tin-copper conductive sheet component from the traditional capacitor structure. By making the capacitor body itself conductive through direct metal layer deposition, the external conductive sheet is removed, simplifying the overall structure and processing.
2Adaptability or versatility
If existing capacitor processing methods are used, then traditional thickness requirements are met, but thinner capacitors cannot be processed and used
Solution Approach 1:
The patent changes the fundamental parameter of how conductivity is achieved. Instead of requiring a minimum thickness for mechanical integrity and then adding external conductive sheets, the invention deposits metal layers directly on the capacitor body surfaces. This allows the capacitor thickness to be reduced while maintaining electrical conductivity through the deposited metal layers, enabling processing of thinner capacitors down to minimal thicknesses.
3Adaptability or versatility
If multiple materials (aluminum, copper, plastic) are combined in three different processes, then capacitor functionality is achieved, but the processing complexity increases
Solution Approach 1:
The patent applies a universal metal layer deposition process that works across all three material types (aluminum, copper, plastic) without requiring separate processing lines. The deposition technique is universally applicable to any capacitor body material, eliminating the need for three different processing processes and reducing overall process complexity while maintaining material compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process allows for direct combination of different metal and non-metal materials, enabling capacitors to be directly welded onto circuit boards without external conductive sheets, while achieving a capacitor resistance of less than 3 milliohms.
Implementation Method 1
electroplating a capacitor base layer, for being compatible with different metal materials; electroplating a metal outer layer, for reducing a capacitor resistance value
Implementation Method 2
vacuum plating a metal layer, for being compatible with different metal materials and non-metal materials
Implementation Method 3
removing oil stains generated during a manufacturing procedure on a surface of a product by using ultrasonic waves and a degreasing agent
Data Source
AI summary
The present invention discloses a capacitor manufacturing process capable of controlling capacitor resistance and without welding a tin-copper conductive sheet. The manufacturing process includes the following working steps: (1) electroplating, involving: electroplating a capacitor base layer, for being compatible with different metal materials; (2) vacuum plating, involving: vacuum plating a metal layer, for being compatible with different metal materials and non-metal materials; and (3) electroplating, involving: electroplating a metal outer layer, for reducing a capacitor resistance value and further controlling the capacitor resistance to be less than 3 milliohms. The beneficial effects of the present invention lie in that: by adopting a process, different metal materials and non-metal materials can be directly combined at the same time, and a capacitor can be directly welded onto a circuit board so as to meet the use requirements.