Capacitor Module Cooling via Integrated Side and Bottom Flow Paths
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Solution Overview
Problem
The cooling performance of capacitor modules in power conversion apparatuses, particularly in hybrid electric vehicles and electric vehicles, needs further improvement due to increased DC power supply requirements, leading to higher heat generation in capacitor cells and bus bars.
Innovation Solution
A power conversion apparatus with a flow path forming body that creates a housing space for the capacitor module, allowing cooling from both bottom and side surfaces, enhancing the cooling performance by forming a meander flow path structure that directs cooling refrigerant to cool both the power semiconductor modules and the capacitor module effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If DC power supply increases to meet high output requirements in hybrid electric vehicles and electric vehicles, then the power output capability is improved, but heat generation in capacitor cells and bus bars increases
Solution Approach 1:
The invention transitions from single-sided cooling to multi-dimensional cooling by forming flow paths on both the bottom surface and side surfaces of the capacitor module. The housing space is positioned above the second flow path part, and the first flow path part is formed at a position facing the side wall, creating a three-dimensional cooling architecture that simultaneously cools multiple surfaces of the capacitor module, thereby effectively managing heat generation while maintaining high power output capability.
2Temperature
If a flow path is formed to surround a capacitor module, then cooling performance is improved, but further improvement demand remains
Solution Approach 1:
The cooling system is segmented into multiple independent flow path parts: a first flow path part formed at a position facing the side wall that forms the housing space, and a second flow path part positioned below the housing space. This segmentation allows separate cooling circuits to target different surfaces of the capacitor module independently, enabling optimized cooling coverage and achieving superior cooling performance that satisfies reliability requirements.
3Temperature
If the capacitor module is cooled by bottom and side surfaces, then cooling performance is improved, but device complexity increases
Solution Approach 1:
The housing space that houses the capacitor module is merged with the cooling system architecture. The flow path forming body integrates the housing function and cooling function, where the housing space is formed above the second flow path part, and the first flow path part is formed at a position facing the side wall. This merging eliminates the need for separate cooling components, achieving multi-surface cooling while maintaining relatively simple device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves the cooling performance of the capacitor module, reducing heat generation and enhancing the reliability and efficiency of the power conversion apparatus.
Implementation Method 1
the capacitor module is cooled by the bottom and side surfaces of the capacitor module
Implementation Method 2
a flow path forming body for cooling a power semiconductor module and a capacitor module
Data Source
AI summary
An object of the present invention is to improve the cooling performance of a capacitor module used in a power conversion apparatus. The power conversion apparatus according to the present invention includes a power semiconductor module, a capacitor module, a flow path forming body that forms a flow path through which a cooling refrigerant flows. The flow path forming body includes a first flow path forming body that forms a first flow path part for cooling the power semiconductor module, and a second flow path forming body that forms a second flow path part for cooling the capacitor module. The first flow path forming body is provided on a side portion of the second follow path forming body and is integrally formed with the second flow path forming body. The second flow path forming body forms a housing space for housing the capacitor module above the second flow path part. The first flow path part is formed at a position facing the side wall that forms the housing space. The power semiconductor module is inserted into the first flow path part.