Fuse-Isolated Capacitor Module for Failed Die Separation
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Solution Overview
Problem
Silicon capacitors in electronic systems can fail, leading to decreased circuit filtering performance, increased noise, signal quality degradation, power instability, and potential system failure, especially in applications with high reliability requirements like medical equipment and automotive electronics.
Innovation Solution
A capacitor module design featuring a circuit structure with fuses connecting pad connection portions and signal transmission portions, allowing for the electrical separation of failed dies by cutting off fuses to isolate the impact of faulty components, thereby maintaining the functionality of the remaining dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon capacitors are used in high reliability applications, then energy storage and voltage stabilization functions are improved, but the risk of system failure due to capacitor damage increases
Solution Approach 1:
The capacitor module is divided into multiple independent die units, each with its own capacitor device and circuit structure. This segmentation allows individual failed dies to be isolated through fuse breaking, preventing single-point failures from affecting the entire module and thereby maintaining voltage stabilization function while reducing system failure risk
Solution Approach 2:
Fuse structures are introduced as intermediary protective elements between the power supply input and the capacitor devices. When a die fails, the corresponding fuse can be broken to interrupt the electrical connection, acting as a mediator that isolates the故障 and prevents harmful effects from propagating through the entire circuit
2Productivity
If multiple dies are integrated in a capacitor module, then productivity and yield are improved, but the impact of failed dies on overall performance increases
Solution Approach 1:
The module integrates multiple independent dies with individual circuit structures, allowing parallel production and testing. When yield optimization is needed, more dies can be integrated. When failures occur, the modular structure enables selective isolation of failed units, thus maintaining both high productivity and performance stability
Solution Approach 2:
Each die within the module has its own dedicated circuit structure and fuse protection, creating local quality zones. This allows the module to achieve high overall yield through integration while maintaining local reliability - a failed die only affects its local circuit region, not the entire module performance
3Ease of repair
If fuses are added to connect pad connection portions and signal transmission portions, then ease of repair and isolation capability are improved, but device complexity increases
Solution Approach 1:
The fuse structures are extracted as separate, dedicated isolation elements within the circuit path. This extraction allows them to perform the specific function of fault isolation without complicating the main capacitor device structure. The fuses can be selectively broken to isolate failures, providing ease of repair while maintaining relatively simple overall circuit architecture
Data Source
AI summary
A capacitor module includes a first die and a second die. Each of the first die and the second die includes a capacitor device and a circuit structure electrically connected to the capacitor device. The circuit structure includes a pad and a first signal line. The first signal line includes a first pad connection portion and a first signal transmission portion. The first pad connection portion is located below the pad and is electrically connected to the pad. The first signal transmission portion is electrically connected to the capacitor device. The first signal line of the first die further includes first fuses connecting the first pad connection portion and the first signal transmission portion. The first signal line of the second die is broken, so that the first pad connection portion of the second die is electrically separated from the first signal transmission portion.