Low Inductance Capacitor Module with Parallel Connectors
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Solution Overview
Problem
Conventional capacitor types and connection techniques in power converter systems are time-consuming, unreliable, and result in high inductance, which is undesirable for power systems, and also hinder optimal heat transfer.
Innovation Solution
A capacitor module with capacitors mounted on a heat transfer carrier substrate, such as DBC or IMS, using parallel connectors to reduce inductance and enhance thermal efficiency, allowing for closer placement to power semiconductor modules and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional screw-based connections are used to connect capacitors to terminals, then reliable electrical connection is achieved, but the connection process becomes time-consuming and productivity decreases
Solution Approach 1:
The patent combines multiple capacitor connections and terminal attachments into a single integrated substrate assembly. The capacitors are pre-mounted on the substrate with their terminals connected to metallization patterns, creating a unified component that attaches to the power module as one unit rather than individually connecting each capacitor, thereby increasing assembly speed while maintaining reliability
Solution Approach 2:
The capacitors are pre-assembled and pre-connected to the substrate before final installation. The substrate is prepared with metallization patterns and connector arrangements in advance, allowing the capacitors to be attached to predetermined locations with pre-established electrical connections, reducing on-site assembly time and improving productivity
2Adaptability or versatility
If conventional capacitor packaging in cylindrical tubes or cuboid boxes is used, then standardization is achieved, but inductance increases due to narrow current paths
Solution Approach 1:
The patent transitions from conventional three-dimensional capacitor packaging (cylindrical tubes or cuboid boxes) to a planar two-dimensional substrate-based arrangement. The capacitors are mounted on a flat substrate with current paths distributed across the surface, allowing for wider, shorter current paths that reduce inductance while maintaining standardized connector interfaces for adaptability
3Ease of manufacture
If conventional capacitor connection techniques are used, then ease of manufacture is maintained, but heat transfer efficiency deteriorates due to lack of thermal interface
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides electrical connections between capacitors and terminals, mechanical support for the capacitor components, and a thermal interface for heat dissipation. The substrate is designed with metallization layers that conduct both electricity and heat, and includes thermal interface features that couple to cooling systems, thereby improving heat transfer efficiency while maintaining manufacturing simplicity through a single integrated component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces inductance and improves thermal management, leading to faster response times and enhanced performance in power systems by spreading current flow and facilitating better heat transfer.
Implementation Method 1
The substrate can be connected thermally to a cooler
Implementation Method 2
Electrical connections to busbars within the capacitor module can be arranged to provide a low inductance by using several single terminals in parallel for achieving a line-wise connector
Data Source
AI summary
According to one embodiment of a capacitor module, the capacitor module includes a substrate having a metallization on a first side of the substrate, a plurality of connectors electrically coupled to the metallization and a plurality of capacitors disposed on the metallization. The plurality of capacitors includes a first set of capacitors electrically connected in parallel between a first set of the connectors and a second set of the connectors. The capacitor module further includes a housing enclosing the plurality of capacitors within the capacitor module.