Capacitor Module Layout With Through-Hole Conductors for Low Wiring Loss
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Solution Overview
Problem
The semiconductor devices face increased wiring loss due to the distance between the voltage regulator and the load, which is exacerbated by the arraying of capacitors, making it difficult to downsize the device.
Innovation Solution
A module with a capacitor layer and through-hole conductors that penetrate the capacitor portion, electrically connecting the voltage regulator and load, reducing the connection distance and incorporating a through-hole conductor to the anode of the capacitor, thereby shortening the wiring length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If capacitors are arrayed using conventional methods, then capacitor functionality is achieved, but connection distance between voltage regulator and load increases causing wiring loss
Solution Approach 1:
The patent transitions from planar capacitor arrangement to three-dimensional vertical stacking, where capacitors are arranged in multiple layers above and below the substrate. This dimensional change allows electrical connections to be made through vertical via holes rather than horizontal traces, significantly reducing the effective connection distance and wiring loss while maintaining capacitor functionality.
Solution Approach 2:
The patent implements nested capacitor structures where capacitor elements are embedded within multi-layer resin compositions that are stacked vertically. The capacitor anodes and cathodes are nested within alternating resin layers, with connection terminals extending through multiple layers. This nesting approach compactly integrates capacitor functionality while minimizing the footprint and connection distance on the substrate.
2Loss of energy
If connection distance is reduced, then wiring loss decreases, but device complexity increases due to through-hole conductor structure
Solution Approach 1:
The patent merges the capacitor electrode structure with the through-hole conductor structure. The capacitor anodes extend vertically to form part of the connection pathway, eliminating the need for separate conductor elements in some cases. This integration reduces the number of discrete components and simplifies the overall structure while achieving short connection distances.
Solution Approach 2:
The vertical capacitor structures serve multiple functions simultaneously: they provide capacitance for voltage regulation, act as connection terminals for electrical pathways, and serve as structural support elements within the multi-layer resin composition. This multi-functionality reduces the need for additional dedicated connection structures, thereby reducing overall device complexity.
Data Source
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AI summary
A module 500 is used in a semiconductor composite device 10 that supplies a direct-current voltage adjusted by a voltage regulator 100 including a semiconductor active element to a load 300. The module 500 includes a capacitor layer 210 including at least one capacitor portion 230 forming a capacitor CP1, a connection terminal used for electrical connection with at least one of the voltage regulator 100 and the load 300, and a through-hole conductor 262 formed to penetrate the capacitor portion 230 in a thickness direction of the capacitor layer 210. The capacitor CP1 is electrically connected to at least one of the load 300 and the voltage regulator 100 with the through-hole conductor 262 interposed between the load 300 and the voltage regulator 100.