Metal-Frame Capacitor Mounting for Vibration-Resistant Board Bonding
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Solution Overview
Problem
Multilayer capacitors used in power driving systems for vehicles face challenges in thermal, electrical, and mechanical reliability due to direct contact with circuit boards, leading to potential deterioration and reduced durability against vibrations and deformation.
Innovation Solution
The electronic component features a metal frame with a roughened bottom surface and a circuit board with matching roughened electrode pads, enhancing the bonding force and durability by increasing the contact area and preventing direct stress transfer, thereby improving thermal, electrical, and mechanical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal frame is used to mount the multilayer capacitor spaced apart from the circuit board, then durability against vibrations and deformation is improved, but bonding force between the metal frame and circuit board deteriorates due to smooth surface contact
Solution Approach 1:
The bottom surface of the mounting portion is selectively roughened to have a different surface quality (roughness of 5-75 μm) than other parts of the metal frame. This local modification increases the contact area and bonding force with the circuit board at the mounting interface, while preserving the smooth surface elsewhere for proper capacitor mounting and electrical performance.
Solution Approach 2:
The surface roughness parameter of the mounting portion bottom surface is changed from smooth (conventional) to rough (5-75 μm). This parameter change enhances the mechanical interlocking and adhesion between the metal frame and circuit board, thereby improving bonding force without compromising the vibration isolation function.
2Ease of operation
If the multilayer capacitor is mounted directly on the circuit board, then ease of installation is improved, but thermal and mechanical reliability deteriorates due to direct stress transfer
Solution Approach 1:
The metal frame acts as an intermediary component between the multilayer capacitor and the circuit board. It provides mechanical support and electrical connection while isolating the capacitor from direct mechanical stress and thermal shocks from the soldering process, thereby improving reliability without significantly complicating the installation process.
Data Source
AI summary
There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.