Ceramic Capacitor Mounting Structure for Substrate Sounding Reduction
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Solution Overview
Problem
Ceramic capacitors cause mechanical distortion and vibration in substrates due to electrostrictive effects, leading to sounding issues, and existing symmetrical mounting methods restrict substrate design freedom.
Innovation Solution
A ceramic capacitor mounting structure where the metal terminal's capacitor connecting portion is parallel to the substrate, primarily allowing vibrations perpendicular to the substrate to propagate, while restraining parallel vibrations, thus reducing substrate sounding without limiting design freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a pair of ceramic capacitors are mounted symmetrical to each other on the front and rear faces of the substrate, then the sounding is reduced, but the degree of freedom in designing the substrate is limited
Solution Approach 1:
The patent applies asymmetry by changing from symmetrical mounting (capacitors on both front and rear faces) to asymmetric mounting (capacitors on only one face). The capacitor is mounted with its terminal electrodes connected to land electrodes on the substrate, with the mounting structure designed to allow vibration cancellation without requiring symmetrical placement on both sides of the substrate.
Solution Approach 2:
The patent introduces an intermediary element - a resin sealing structure or mounting structure - that mediates between the ceramic capacitor and the substrate. This intermediary structure allows the capacitor to be mounted on one face only while still achieving vibration cancellation effects, thus resolving the contradiction between reducing sounding and maintaining design freedom.
2Object-generated harmful factors
If ceramic capacitors are mounted to reduce sounding, then vibration propagation is suppressed, but substrate design flexibility is reduced
Solution Approach 1:
The patent employs asymmetric mounting configuration where capacitors are placed on only one face of the substrate rather than symmetrically on both faces. The terminal electrodes are connected to land electrodes through a designed mounting structure that achieves vibration suppression without requiring symmetrical design constraints on the substrate.
Solution Approach 2:
The patent applies local quality by designing specific mounting regions with resin sealing structures that locally manage vibration characteristics. The mounting structure is designed with specific properties at the capacitor-substrate interface to suppress vibration propagation while leaving other areas of the substrate free for design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces substrate sounding by directing ceramic capacitor vibrations perpendicular to the substrate, maintaining design flexibility for capacitor mounting.
Implementation Method 1
a mechanical distortion having a magnitude corresponding to the applied voltage occurs in the ceramic sintered body because of the electrostrictive effect of the ceramic
Implementation Method 2
the first capacitor connecting portion of the first metal terminal is parallel to the substrate... vibrations in directions parallel to the substrate are restrained from propagating to the substrate
Implementation Method 3
make vibrations in directions perpendicular to the substrate mainly propagate to the substrate
Data Source
AI summary
A ceramic capacitor comprises a ceramic sintered body, and first and second terminal electrodes formed on outer surfaces of the ceramic sintered body. The first terminal electrode is electrically connected to a land formed on a substrate through a first metal terminal. The first metal terminal has a first capacitor connecting portion mechanically connected to the first terminal electrode, a first terminal portion mechanically connected to the land, and a first intermediate portion electrically connecting the first capacitor connecting portion and the first terminal portion to each other. The first capacitor connecting portion of the first metal terminal is parallel to the substrate.