Capacitor Structure With Nitrogen-Enhanced Dielectric
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Solution Overview
Problem
The integration degree of semiconductor devices is compromised when attempting to improve the electrical characteristics of capacitor structures by increasing the thickness of the dielectric layer, as this often leads to deteriorated performance.
Innovation Solution
A capacitor structure is designed with a lower electrode made of metal nitride and a dielectric layer comprising metal oxide and nitrogen, where the nitrogen content is maximized, particularly through a process involving seed layers and oxidation, allowing for enhanced permittivity without increasing the dielectric layer's thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the dielectric layer is increased to improve the permittivity and electrical characteristics of the capacitor structure, then the electrical characteristics are improved, but the integration degree of the semiconductor device is deteriorated
Solution Approach 1:
The patent changes the chemical composition parameters of the dielectric layer by incorporating nitrogen into the metal oxide structure. This compositional parameter change increases the permittivity of the dielectric material itself, allowing for improved electrical characteristics without increasing the physical thickness of the layer, thus maintaining device integration density
Solution Approach 2:
The patent creates a composite dielectric material by combining metal oxide with nitrogen, forming a nitrogen-containing metal oxide compound. This composite material achieves higher permittivity than conventional metal oxides alone, enabling improved capacitor performance without requiring increased layer thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the electrical characteristics of the capacitor structure while maintaining the integration degree of the semiconductor device, ensuring improved performance without compromising device integration.
Implementation Method 1
The dielectric layer may include a metal oxide and nitrogen (N), the metal oxide having a chemical formula of M2Ox
Implementation Method 2
performing an oxidation process on the third seed layer to form a dielectric layer
Data Source
AI summary
A capacitor structure may include a lower electrode on a substrate, a dielectric layer on the substrate, and an upper electrode on the dielectric layer. The lower electrode may include a metal nitride having a chemical formula of M1Ny (M1 is a first metal, and y is a positive real number). The dielectric layer may include a metal oxide and nitrogen (N), the metal oxide having a chemical formula of M2Ox (M2 is a second metal, and x is a positive real number). A maximum value of a detection amount of nitrogen (N) in the dielectric layer may be greater than a maximum value of a detection amount of nitrogen (N) in the lower electrode.


