Vibration Absorbing Insulating Layer for Capacitor Noise Reduction
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Solution Overview
Problem
Existing mounting structures for multilayer ceramic capacitors on circuit boards generate acoustic noise due to vibrations, and existing noise reduction techniques are limited to dual-sided mounting, reducing design freedom when capacitors are mounted on one side.
Innovation Solution
A mounting structure with a circuit board comprising a first insulating layer and a second insulating layer with a lower Young's modulus, closer to the capacitor, to absorb vibrations and reduce noise without compromising design freedom, and a multilayer capacitor built-in substrate with a resin layer to further mitigate vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a multilayer capacitor is mounted on one surface of the circuit board, then design freedom is maintained, but acoustic noise is generated due to vibrations
Solution Approach 1:
The patent introduces a vibration absorption member as an intermediary component between the multilayer capacitor and the circuit board. This member absorbs vibrations generated by the capacitor, preventing them from propagating to the board and causing acoustic noise, while allowing the capacitor to remain mounted on a single surface
Solution Approach 2:
The vibration absorption member is constructed using composite material structure, combining materials with different properties to effectively dampen vibrations. The composite structure includes a first vibration absorption member and a second vibration absorption member with different characteristics, working together to reduce acoustic noise
2Quantity of substance
If multilayer ceramic capacitors with high-dielectric-constant ceramic material are used, then capacitance is increased, but mechanical distortion occurs causing vibrations
Solution Approach 1:
The patent converts the harmful mechanical distortion and vibrations generated by high-dielectric-constant ceramic materials into a manageable phenomenon by introducing vibration absorption members. These members specifically target and absorb the vibrations caused by the piezoelectric and electrostrictive properties of the ceramic material, allowing high capacitance to be achieved without acoustic noise
3Object-generated harmful factors
If vibration absorption members are added to reduce noise, then acoustic noise is reduced, but device complexity increases
Solution Approach 1:
The patent merges the vibration absorption function with the existing mounting structure by integrating the vibration absorption members into the circuit board assembly. The first and second vibration absorption members are positioned to work together with the multilayer capacitor, creating a unified structure that reduces acoustic noise without requiring separate, complex vibration isolation systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces vibrations and noise on the circuit board without decreasing design freedom, even when capacitors are mounted on one side, by using a layered structure with varying Young's moduli to absorb and cancel out vibrations.
Implementation Method 1
vibrations propagate to the first insulating layer having the higher Young's modulus through the second insulating layer having the lower Young's modulus. Accordingly, vibrations are absorbed by the second insulating layer having the lower Young's modulus
Data Source
AI summary
A mounting structure includes a circuit board including one principal surface on which a multilayer capacitor is mounted. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer. A multilayer capacitor built-in substrate includes a circuit board, a multilayer capacitor on one principal surface of the circuit board, and a resin layer on the one principal surface of the circuit board and embedding the multilayer capacitor. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer.