Multilayer Capacitor Noise Suppression via Segmented Electrode Layout
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Solution Overview
Problem
Existing electronic components with multilayer capacitors mounted on interposers face challenges in fully suppressing acoustic noise due to electrostrictive vibrations, which propagate from the capacitor to the device, causing unwanted noise.
Innovation Solution
The design features a multilayer capacitor with external and internal electrodes configured to minimize direct vibration transfer to the interposer, using a specific layout where the second portions of the capacitor are separated from the interposer, and the external electrodes are connected to the interposer through narrower electrodes, allowing vibrations to attenuate through the substrate, thereby reducing noise propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the element body of the multilayer capacitor is in contact with the interposer, then electrical connection is achieved, but electrostrictive vibration propagates directly to the interposer causing acoustic noise
Solution Approach 1:
The element body is divided into a first portion (covered by external electrode) and second portions (exposed and separated from interposer). This segmentation allows electrical connection through the first portion while isolating the vibration-prone second portions from direct contact with the interposer, reducing noise transmission.
Solution Approach 2:
The external electrode and first electrode of the interposer act as intermediary elements between the multilayer capacitor and the interposer substrate. These electrodes provide the electrical connection path while the narrower width and separation distance create a mechanical buffer that attenuates vibration transmission to the substrate.
2Object-generated harmful factors
If the widths of external electrodes and first electrodes are made smaller, then vibration propagation is reduced, but electrical connection area is decreased
Solution Approach 1:
The widths of the external electrodes and first electrodes are optimized to specific ranges (0.3-0.7 times the width of the multilayer body) to achieve a balance between mechanical vibration attenuation and electrical connection reliability. This parameter optimization ensures sufficient electrical connection area while maintaining effective vibration isolation.
3Object-generated harmful factors
If the second portions of the multilayer body are separated from the interposer, then acoustic noise is suppressed, but mounting stability may be affected
Solution Approach 1:
The element body is segmented into a first portion for mounting (covered by external electrode) and second portions for separation (exposed and not contacting the interposer). This segmentation enables the first portion to provide stable electrical and mechanical connection while the separated second portions minimize vibration transmission to the interposer.
Solution Approach 2:
Different portions of the element body are given different functional qualities: the first portion (under the external electrode) is designed for contact and electrical connection with the interposer, while the second portions are designed for separation to reduce vibration. This local differentiation of function resolves the contradiction between stability and noise suppression.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses acoustic noise by reducing vibration transmission from the multilayer capacitor to the electronic device, while allowing for high-density mounting and maintaining sufficient capacitance.
Implementation Method 1
When a voltage is applied to the multilayer capacitor, an element body thereof is subject to mechanical strain in the magnitude according to the applied voltage due to the electrostrictive effect. This mechanical strain induces vibration in the multilayer capacitor
Data Source
AI summary
An electronic component includes a multilayer capacitor and an interposer. The multilayer capacitor includes an element body and a pair of external electrodes. The interposer includes a substrate having first and second principal faces, a pair of first electrodes disposed on the first principal face, and a pair of second electrodes disposed on the second principal face so as to be separated from the pair of first electrodes in a first direction or in a second direction. Widths of the pair of external electrodes and the pair of first electrodes are smaller than a width of the element body. The element body has a first portion covered by the external electrode, and a pair of second portions located on both sides of the first portion. The pair of second portions are separated from the interposer and overlap the pair of second electrodes when viewed from a third direction.