Capacitor Arrangement with Offset Heat Sink

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Solution Overview

Problem

In power control units, especially in automobiles, capacitors generate heat, and existing heat sink configurations often lead to inefficient heat dissipation and increased component sizes due to direct contact requirements, limiting space and increasing temperature risks.

Innovation Solution

A capacitor arrangement structure where the casing with a capacitor is positioned inside a housing with a heat sink placed on the outer surface, separated from the casing, and a cooling passage is used to direct airflow and cooling water for efficient heat dissipation, allowing the casing to be positioned lower than the heat sink, thus avoiding direct contact and reducing overall component height.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the capacitor is positioned directly on the heat sink, then heat dissipation efficiency is improved, but the overall component height increases and mounting space is reduced

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidcomponent height
Core Design Contradiction:
TemperatureVSLength of stationary object

Solution Approach 1:

The patent transitions from vertical stacking (capacitor directly on heat sink) to a configuration where the heat sink extends horizontally on the outer surface of the bottom wall. This dimensional change allows heat dissipation without increasing component height, as the heat sink operates in the horizontal plane rather than vertically

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If the heat sink is placed on the outer surface of the bottom wall separated from the casing, then mounting flexibility and space utilization are improved, but direct thermal contact is reduced

Engineering Contradiction:
Improvemounting flexibilityVSAvoidthermal contact efficiency
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent introduces a mounting surface on the inner surface that serves as an intermediary structure. This mounting surface provides both mechanical support for the capacitor and thermal conduction path to the heat sink on the outer surface, enabling separated positioning while maintaining thermal efficiency

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents excessive temperature increases in capacitors, maintains their functionality, and allows for a more compact design by eliminating the need for direct casing-to-heat sink contact, enabling easier mounting in smaller vehicles with limited space.

Implementation Method 1

The heat sink is provided on the outer surface of the bottom wall not to overlap the casing viewed along the height direction. The heat sink top opposes the outer surface.

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a cooling passage is used to direct airflow and cooling water for efficient heat dissipation

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS9793048B2Capacitor arrangement structure
Publication Date: 2017.10.17 HONDA MOTOR CO LTD
  • US9793048B2 patent drawing
  • US9793048B2 patent drawing
  • US9793048B2 patent drawing

AI summary

A capacitor arrangement structure includes a casing, a housing, and a heat sink. The casing accommodates a capacitor. The casing includes a casing bottom. The housing includes a bottom wall. The housing has a height from the bottom wall which includes an inner surface and an outer surface opposite to the inner surface in a height direction. The casing is mounted on the inner surface so that the casing bottom opposes a mounting surface in the inner surface. The heat sink includes a heat sink top. The heat sink is provided on the outer surface of the bottom wall not to overlap the casing viewed along the height direction. The heat sink top opposes the outer surface. A distance between the casing bottom and the mounting surface in the height direction is smaller than a distance between the heat sink top and the mounting surface in the height direction.