Winding-Type Capacitor Package Structure Fixation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing capacitor package structures require additional fixing structures or deformation of the casing to secure the bottom enclosing structure, which can be cumbersome and inefficient.
Innovation Solution
A winding-type capacitor package structure that includes a winding assembly, a package assembly, and a conductive assembly, where the bottom enclosing structure is surrounded by and tightly connected to the casing structure using a filling body, eliminating the need for extra fixing structures and maintaining the casing's original shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional fixing structures or casing deformation are used to secure the bottom enclosing structure, then the fixation reliability is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The filling body automatically secures the bottom enclosing structure through its own material properties (viscosity and curing characteristics) without requiring external fixing structures. The filling body serves both its primary function of filling the accommodating space and the secondary function of fixing the bottom enclosing structure, eliminating the need for separate fixing mechanisms.
Solution Approach 2:
The filling body's physical parameters (viscosity and curing state) are utilized to achieve fixation. By controlling the filling body's material parameters, it can transition from a liquid state that flows to fill the space to a cured state that provides mechanical support and fixation, thereby securing the bottom enclosing structure without additional components.
2Reliability
If additional fixing structures are added to secure the bottom enclosing structure, then the fixation reliability is improved, but the manufacturing time and productivity are reduced
Solution Approach 1:
The fixing function is merged with the filling body's primary function. The same filling body that fills the accommodating space also provides the fixation mechanism for the bottom enclosing structure, combining two functions into one component and eliminating separate fixing operations in the manufacturing process.
Solution Approach 2:
The filling body performs the fixation function as part of its own operational sequence during manufacturing. As the filling body is placed and then cured, it automatically secures the bottom enclosing structure without requiring separate fixing steps, thereby streamlining the manufacturing process and improving productivity.
3Reliability
If the casing structure is deformed to fix the bottom enclosing structure, then the fixation reliability is improved, but the manufacturing precision and casing integrity are compromised
Solution Approach 1:
The filling body acts as an intermediary between the bottom enclosing structure and the casing structure. Instead of deforming the casing to achieve fixation, the filling body provides a compliant medium that adapts to the casing's original shape while securing the bottom enclosing structure, thereby preserving the casing's manufacturing precision and structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for secure fixation of the bottom enclosing structure within the casing without additional fixing methods or deformation, enhancing manufacturing efficiency and package integrity.
Implementation Method 1
the bottom enclosing structure is surrounded by the casing structure and is tightly connected to the filling body
Data Source
AI summary
A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.