Capacitor Package Structure With Exposed Lateral Electrodes
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Solution Overview
Problem
Existing capacitor assembly package structures face challenges in efficiently connecting and encasing capacitors within a package structure, particularly in ensuring proper electrical connections and preventing moisture ingress.
Innovation Solution
A method involving a capacitor unit with positive and negative portions electrically connected to a conductive layer, partially enclosed by an insulative package body, and connected using first and second electrode structures, with specific lateral surfaces flush to facilitate electrical connections and prevent moisture entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the capacitor is fully enclosed by the insulative package body, then moisture protection is improved, but electrical connection to the positive portion becomes difficult
Solution Approach 1:
The positive lateral surface of the positive portion is extracted/exposed from the insulative package body, creating an accessible connection surface while the rest of the capacitor remains enclosed for moisture protection. This allows the electrode structure to make electrical contact with the positive portion without requiring full exposure of the capacitor.
Solution Approach 2:
The electrode structure is nested within the insulative package body, enclosing a first portion of it, while still being able to electrically connect to the exposed positive lateral surface. This nested arrangement provides both protection and connectivity.
2Ease of manufacture
If the positive lateral surface is exposed from the package body surface, then electrical connection is improved, but structural integrity may be compromised
Solution Approach 1:
Only the necessary positive lateral surface is extracted/exposed for electrical connection, minimizing the opening in the insulative package body and maintaining structural integrity while providing adequate access for the electrode structure to connect.
Solution Approach 2:
The electrode structure is nested within the insulative package body, providing mechanical support and structural reinforcement while making electrical contact with the exposed positive lateral surface, thus maintaining overall structural integrity.
3Quantity of substance
If multiple capacitors are stacked together to form a stacked solid electrolytic capacitor, then electrical capacity is improved, but complexity of assembly and connection increases
Solution Approach 1:
Multiple capacitors are stacked and enclosed together within a single insulative package body, merging their protective housings. The electrode structures connect to multiple capacitors simultaneously through the exposed surfaces, simplifying the overall assembly process while maintaining high electrical capacity.
Solution Approach 2:
The insulative package body serves multiple functions: it encloses and protects multiple capacitors, provides structural support for the stacked arrangement, and facilitates electrical connections through the exposed positive lateral surfaces. The electrode structures also perform dual functions of mechanical support and electrical connection.
Data Source
AI summary
A method of manufacturing a capacitor assembly package structure includes providing a capacitor unit and a conductive connection layer, in which the capacitor unit includes a plurality of capacitors, and each of the capacitors includes a positive portion and a negative portion electrically connected to the conductive connection layer; partially enclosing the capacitors by an insulative package body, in which the positive portion of each of the capacitors has a positive lateral surface exposed from a first lateral surface of the insulative package body; and then enclosing a first portion of the insulative package body and electrically connecting to the positive portion of each of the capacitors by a first electrode structure, and enclosing a second portion of the insulative package body and electrically connecting to the conductive connection layer by a second electrode structure.