Capacitor Assembly Package Structure for High-Density Layer Stacking

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Solution Overview

Problem

Existing capacitor technologies face challenges in reducing the vertical distance between the positive and negative electrode portions, leading to potential leakage and limited stackability of capacitor elements.

Innovation Solution

Incorporating a raised protruding structure on the positive electrode portion of each capacitor element, which acts as a spacer to reduce the vertical distance between the positive and negative electrode portions, thereby enhancing stackability and reducing the risk of leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the vertical distance between positive and negative electrode portions is reduced, then stackability of capacitor elements is improved, but the risk of leakage increases

Engineering Contradiction:

ImprovestackabilityVSAvoidleakage risk

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

A dielectric protruding structure is introduced as an intermediary element between the positive and negative electrode portions. This protruding structure extends from the positive electrode toward the negative electrode, creating additional insulation barriers that prevent leakage while enabling reduced spacing between electrodes for improved stackability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The solution transitions from planar electrode arrangement to three-dimensional electrode configuration by adding vertical protruding structures. This dimensional change allows the electrodes to maintain electrical isolation through the protruding dielectric structures while reducing the horizontal spacing between adjacent capacitor elements, thereby improving stackability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If capacitor elements are stacked closer together, then the number of layers increases, but structural integrity may be compromised

Engineering Contradiction:

Improvenumber of layersVSAvoidstructural integrity

Core Design Contradiction:

ProductivityVSStrength

Solution Approach 1:

The capacitor assembly employs composite material structures combining conductive electrode materials with dielectric materials having different mechanical and electrical properties. The dielectric protruding structures are made from materials that provide both electrical insulation and mechanical support, enabling close stacking while maintaining structural integrity of the multi-layer assembly.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS12586732B2Capacitor assembly package structure having outermost reinforcement structures

Publication Date: 2026.03.24 APAQ TECH

AI summary

A capacitor assembly package structure includes a first bottom electrode structure, a second bottom electrode structure, a capacitor assembly and an insulating package body. The second bottom electrode structure is separate from the first bottom electrode structure. The capacitor assembly is disposed on the first bottom electrode structure and the second bottom electrode structure. The capacitor assembly includes a plurality of capacitor elements electrically connected to each other, and each capacitor element has a positive electrode portion electrically connected to the first bottom electrode structure and a negative electrode portion electrically connected to the second bottom electrode structure. The insulating package body is configured to cover the capacitor elements of the capacitor assembly. Each capacitor element has a raised protruding structure disposed on the positive electrode portion to reduce a shortest vertical distance between the positive electrode portion and the negative electrode portion of each capacitor element.