Solid Electrolytic Capacitor Pad Mounting for Precision Assembly
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Solution Overview
Problem
Conventional solid electrolytic capacitors face challenges in manufacturing precision due to the need for bending terminals, which increases equivalent series resistance (ESR) and equivalent series inductance (ESL) and reduces space factor, and assembly precision issues during welding of the anode lead and pad member.
Innovation Solution
A solid electrolytic capacitor design that mounts the capacitor element on an insulating substrate with a pad member having electrical insulation properties, allowing for adjustable height and reduced positional shift during assembly, and incorporating fitting grooves and slits to enhance precision and space factor, while maintaining low ESR and ESL.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the capacitor element is mounted on an insulating substrate with a pad member, then assembling precision is improved and positional shift during welding is reduced, but the device structure becomes more complex
Solution Approach 1:
The insulating substrate is segmented into a substrate body and a separately formed pad member that projects from the substrate surface. This segmentation allows the pad member to be independently positioned and adjusted, improving assembling precision while maintaining manageable device complexity through modular construction.
Solution Approach 2:
The pad member acts as an intermediary component between the capacitor element and the insulating substrate. It provides a stable welding surface that prevents positional shift during welding operations, improving manufacturing precision without requiring the entire substrate structure to be overly complex.
2Reliability
If the capacitor element is mounted on an insulating substrate, then ESR and ESL are reduced, but the space factor is constrained by substrate dimensions
Solution Approach 1:
The pad member extends in the vertical dimension from the insulating substrate surface, allowing the capacitor element to be mounted at an optimized height. This dimensional approach reduces ESR and ESL by shortening electrical paths while maintaining a compact horizontal footprint, thus improving space factor.
Solution Approach 2:
The insulating substrate provides localized electrical insulation properties where needed, while the pad member provides localized mechanical support and electrical connection. This localized functional distribution achieves low ESR and ESL without requiring the entire device to occupy excessive space.
3Manufacturing precision
If a pad member with adjustable height is used, then positional shift during welding is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The pad member is pre-formed with a specific height and shape before being attached to the insulating substrate. This preliminary action allows the height to be precisely controlled during pad member fabrication, ensuring minimal positional shift during welding without adding complex adjustment mechanisms to the overall manufacturing process.
Solution Approach 2:
The height of the pad member is controlled as a fixed parameter during its formation process. By optimizing this single parameter, the design achieves reduced positional shift during welding while maintaining ease of manufacture, as no complex adjustable mechanisms are required.
Data Source
AI summary
The solid electrolytic capacitor includes a solid electrolyte type capacitor element including a dielectric layer intervening between an anode section and a cathode section, and an insulating substrate. The insulating substrate includes a first surface on which the capacitor element is mounted and a second surface opposite to the first surface. The first surface is provided thereon with a first anode layer to which the anode section is electrically connected and a first cathode layer to which the cathode section is electrically connected. The second surface is provided thereon with a second anode layer electrically connected to the first anode layer and a second cathode layer electrically connected to the first cathode layer. Here, a pad member with electrical insulation property projects on the first surface of the insulating substrate, and the first anode layer is formed on a tip end surface of the pad member.