Multilayer Capacitor Permittivity Zoning for Withstand Voltage
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Solution Overview
Problem
Multilayer ceramic capacitors face reliability issues due to thickness variations and electric field concentration at widthwise end portions, leading to potential dielectric breakdown and reduced lifespan.
Innovation Solution
The multilayer electronic component design includes a dielectric layer with a higher permittivity at the widthwise central portion and lower permittivity at the end portions, enhancing capacitance and withstand voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of layers is increased to achieve high capacitance, then capacitance is improved, but the step between printed and unprinted portions becomes larger and reliability deteriorates
Solution Approach 1:
The patent applies local quality by forming a fill material in the gap region between internal electrodes to create a localized structural improvement. This fill material has different properties than the surrounding dielectric layer, specifically addressing the step formation issue at the widthwise end portions without affecting the overall capacitance structure. The fill material prevents ceramic green sheet and internal electrode movement into the gap, thereby maintaining dielectric layer thickness and preventing high electric field concentration at critical regions.
2Volume of moving object
If miniaturization is pursued to reduce component size, then device size is reduced, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The patent applies preliminary action by forming the fill material in the gap before the final sintering process. This preliminary structural preparation prevents subsequent movement and deformation of ceramic green sheets and internal electrodes during compression and sintering. By pre-establishing the gap filling structure, the invention maintains manufacturing precision even as component size is reduced for miniaturization applications.
3Quantity of substance
If the dielectric layer thickness is reduced to increase capacitance density, then capacitance density is improved, but withstand voltage deteriorates due to high electric field generation
Solution Approach 1:
The patent converts the harmful effect of gap formation during stacking into a beneficial structure. The gap, which initially causes problems by allowing material movement and creating thin dielectric regions, is deliberately filled with a specialized fill material. This fill material has properties that prevent further material movement and eliminate high electric field concentration, thereby improving withstand voltage while maintaining the reduced dielectric thickness needed for high capacitance density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves reliability and withstand voltage while maintaining high capacitance, addressing the thickness-related issues in multilayer ceramic capacitors.
Implementation Method 1
the first region has a higher permittivity than the second regions
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer and external electrodes disposed on the body, wherein, when a widthwise central portion of the dielectric layer is a first region and widthwise end portions of the dielectric layer are second regions, the first region has a higher permittivity than the second regions.