Wound Capacitor Pin Guide Structure for Shock-Resistant Bonding
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Solution Overview
Problem
Existing wound capacitor technologies lack effective methods for firmly fixing or bonding conductive pins to circuit substrates, leading to potential circuit breaks and inadequate shock resistance.
Innovation Solution
A wound capacitor package structure with a conductive assembly and a bottom seat plate that includes specific gaps and guide channels for conductive pins, allowing capillary action to secure the pins to the substrate, enhancing shock resistance and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wound capacitor structures are used, then the device can be manufactured with standard processes, but the conductive pins cannot be firmly bonded to the circuit substrate, leading to potential circuit breaks
Solution Approach 1:
The patent replaces traditional mechanical bonding methods (soldering, welding, or mechanical fastening) with capillary action-based bonding. The conductive pins are designed with specific gap dimensions (0.01-0.2mm) that enable conductive material to be drawn into the gaps through capillary forces during reflow processing, creating firm bonds without complex mechanical bonding mechanisms.
Solution Approach 2:
The patent specifies precise parameter ranges for the gaps between conductive pins and the circuit substrate (0.01-0.2mm) and for the exposed heights of the pins (0.01-0.3mm). These parameter changes are critical for enabling capillary action while preventing short circuits, thereby achieving reliable bonding through controlled dimensional parameters rather than complex bonding processes.
2Strength
If conventional wound capacitor structures are used, then the manufacturing process remains simple, but the device has inadequate shock resistance
Solution Approach 1:
The patent performs preliminary action by pre-configuring the conductive pins with specific exposed heights (0.01-0.3mm) and gap dimensions (0.01-0.2mm) before the bonding process. This preliminary configuration ensures that during subsequent shock events, the pins are already optimally positioned to maintain electrical connection and absorb mechanical stress, enhancing shock resistance without requiring additional shock-absorbing structures.
Solution Approach 2:
The patent introduces the conductive material (solder or conductive adhesive) as an intermediary substance that fills the gaps between the conductive pins and the circuit substrate. This intermediary material not only establishes electrical connection but also acts as a shock-absorbing medium, distributing mechanical stresses and protecting the fragile internal wound structure from shock damage.
3Reliability
If the conductive pins are exposed longer to ensure bonding, then bonding reliability improves, but the risk of short circuit increases
Solution Approach 1:
The patent precisely controls the exposed height of conductive pins within the range of 0.01-0.3mm and the gap dimensions within 0.01-0.2mm. This parameter optimization ensures sufficient exposure for reliable capillary bonding while maintaining safe clearance to prevent short circuits. The controlled parameters create an optimal balance between bonding reliability and electrical isolation.
Solution Approach 2:
The patent utilizes capillary action (a fluid dynamics phenomenon) to draw conductive material into the precisely dimensioned gaps between the pins and substrate. This hydraulic principle enables reliable bonding through the automatic wicking of molten solder or conductive adhesive into the narrow gaps, eliminating the need for excessive pin exposure and reducing short circuit risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure ensures firm bonding of conductive pins to the circuit substrate, improving shock resistance and preventing circuit breaks, particularly in vehicles, through capillary action.
Implementation Method 1
the first exposed portion of the first conductive pin is configured to guide a portion of the first conductive material into the first gap defined between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom seat plate through capillary action
Implementation Method 2
the second exposed portion of the second conductive pin is configured to guide a portion of the second conductive material into the second gap defined between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom seat plate through capillary action
Data Source
AI summary
A movable device and a wound capacitor package structure thereof are provided. A first gap defined between a first exposed portion of a first conductive pin and an inner surface of a first bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, and a first exposed height defined from a bottom side of the first exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm. A second gap defined between a second exposed portion of a second conductive pin and an inner surface of a second bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, and a second exposed height defined from the bottom side of the second exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm.