Capacitor Placement for Noise Reduction in Semiconductor Devices
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Solution Overview
Problem
Existing semiconductor devices face challenges in reducing noise interference, which affects their operational stability, particularly due to the length of wiring connections that can lead to electromagnetic noise propagation, impacting the reliability of control systems in applications like automobiles and motorized two-wheeled vehicles.
Innovation Solution
An electronic device configuration is implemented with a wiring substrate that includes a semiconductor device and a capacitor, where the capacitor is strategically positioned closer to the semiconductor device than to external terminals, and the wiring paths are arranged to minimize phase differences and impedance, using ceramic capacitors for effective noise filtering across the power supply and output lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the capacitor is mounted on the wiring substrate with conventional wiring layout, then the external terminals can be connected to the semiconductor device, but the wiring length increases causing noise propagation and reduced reliability
Solution Approach 1:
The capacitor is strategically positioned closer to the semiconductor device than to external terminals, creating different wiring path lengths for different functional requirements. This local optimization reduces the wiring length for noise-critical paths while maintaining external connectivity
Solution Approach 2:
The capacitor serves as an intermediary noise suppression component between the external terminals and the semiconductor device. By placing it at an optimized position, it filters noise before it reaches the semiconductor device while maintaining necessary electrical connections
2Reliability
If the capacitor is positioned closer to external terminals, then external connections are simplified, but the noise filtering effectiveness for the semiconductor device is reduced
Solution Approach 1:
The wiring layout is optimized with different path lengths for different functions: shorter paths for noise-critical semiconductor device connections and longer paths for external terminals. This asymmetric layout places the capacitor closer to the semiconductor device to maximize noise filtering while maintaining external connectivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the noise resistance and operational reliability of semiconductor devices by reducing noise propagation and impedance, thereby improving the stability of control systems in vehicles.
Implementation Method 1
a power supply wiring and a reference potential supply wiring for phase locked loop in a semiconductor device are coupled for suppressing crosstalk noise. Additionally, the coupled power supply wiring and reference potential supply wiring are connected to a capacitor.
Implementation Method 2
there is room for improvement from the viewpoint of effectively reducing the noise
Data Source
AI summary
An electronic device according to one embodiment includes a wiring substrate, the wiring substrate having a first wiring connected to a first external terminal and a second wiring connected to a second external terminal and extending along the first wiring. Additionally, the above electronic device has a semiconductor device mounted on the above wiring substrate and electrically connected to each of the first and second wirings. Further, the above electronic device has a capacitor mounted on the above wiring substrate and electrically connected to the semiconductor device via each of the above first and second wirings. Furthermore, a distance between the above semiconductor device and capacitor is shorter than a distance between each of the above first and second external terminals and the above capacitor.