Three-Terminal Capacitor Plating Grounding Terminal
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Solution Overview
Problem
Conventional three-terminal capacitors face challenges in achieving high positional accuracy for conductive paste application, leading to reduced electrode cross-sectional area at junctions, increased ESL, and deteriorated insertion loss characteristics due to the need for larger signal terminals to cover internal electrodes.
Innovation Solution
A capacitor design with a grounding terminal featuring a plating layer directly connected to the internal electrode, eliminating the need for a calcined conductive layer, allowing for improved positional accuracy and increased electrode cross-sectional area, and a manufacturing method involving conductive paste application, calcining, and plating layer formation to enhance bonding strength and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conductive paste is mechanically applied to the ceramic body, then the signal terminals can be formed, but high positional accuracy cannot be achieved leading to reduced electrode cross-sectional area
Solution Approach 1:
The patent replaces the mechanical paste application system with a plating system. Instead of mechanically applying conductive paste to form the grounding terminal, the invention uses electroplating or electroless plating to deposit a plating layer on the internal electrode that extends to the side surface. This substitution eliminates the positional accuracy limitations of mechanical application while achieving precise metal-to-metal contact and maintaining large electrode cross-sectional area.
Solution Approach 2:
The patent changes the formation method parameter from mechanical paste application to plating deposition. By changing how the grounding terminal is formed (from paste-based to plating-based), the invention achieves both high positional accuracy and large contact area, resolving the contradiction between manufacturing precision and reliability.
2Manufacturing precision
If signal terminals are made larger to cover internal electrodes, then positional coverage is improved, but electrode cross-sectional area at junctions is reduced
Solution Approach 1:
The patent extends the grounding terminal in a new dimension - from the end surface to the side surface of the ceramic body. By making the plating layer extend laterally along the side surface, the invention achieves both comprehensive coverage and large cross-sectional area at the junction, eliminating the need to enlarge signal terminals at the expense of junction area.
3Reliability
If calcined layers are used for grounding terminal, then conductive connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the grounding terminal formation with the existing plating process used for signal terminals. By using the same plating layer to form both the signal terminal connections and the grounding terminal, the invention eliminates separate paste application and calcining steps, reducing manufacturing complexity while maintaining reliable conductive connection.
Solution Approach 2:
The plating layer serves multiple functions: it provides conductive connection for signal terminals, forms the grounding terminal, and creates metal-to-metal contact with the internal electrode. This multi-functionality eliminates the need for separate calcined layers, simplifying the manufacturing process while ensuring reliable conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in improved insertion loss characteristics and increased reliability by reducing ESL and preventing moisture ingress, while simplifying the manufacturing process and reducing costs.
Implementation Method 1
The at least one plating layer may preferably be formed by wet plating, for example.
Implementation Method 2
a conductive paste is applied to the ceramic body and then calcined
Data Source
AI summary
A capacitor includes a capacitor body made of a dielectric, a first internal electrode, a second internal electrode, a first signal terminal, a second signal terminal, and a grounding terminal. The first and second signal terminals are connected to the first internal electrode. The grounding terminal is disposed on the outer surface of the capacitor body so as to be connected to the second internal electrode. The grounding terminal is connected to the ground potential. The grounding terminal includes a plating layer which is disposed on the capacitor body and which is connected to the second internal electrode.